Invention Grant
- Patent Title: Thin film transistor and method for fabricating same
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Application No.: US10693395Application Date: 2003-10-24
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Publication No.: US06797535B2Publication Date: 2004-09-28
- Inventor: Hiroshi Tanabe
- Applicant: Hiroshi Tanabe
- Priority: JP11-263635 19990917
- Main IPC: H01L2100
- IPC: H01L2100

Abstract:
In a thin film transistor provided with a metallic layer with a light-shading property and a Si layer formed on an insulating layer, a dent for locally thinning the insulating layer is formed on a portion corresponding to a drain region. When the Si layer is recrystallized by means of a laser light irradiation, the dent serves as a crystalline nucleus formation region in order to recrystallize a particular portion earlier than other portions. Recrystallization of melted Si starts from a periphery of a bottom surface of the dent, hence a Si layer formed of a single crystal or uniformed crystal grains which serves as an active region of the TFT can be obtained.
Public/Granted literature
- US20040084728A1 Thin film transistor and method for fabricating same Public/Granted day:2004-05-06
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