• Patent Title: Polyolefin resin for hot-melt adhesive
  • Application No.: US10297576
    Application Date: 2002-12-12
  • Publication No.: US06797774B2
    Publication Date: 2004-09-28
  • Inventor: Masato Kijima
  • Applicant: Masato Kijima
  • Priority: JP2000-178420 20000614
  • Main IPC: C08L2312
  • IPC: C08L2312
Polyolefin resin for hot-melt adhesive
Abstract:
The present invention provides a polyolefin resin for hot melt adhesives containing [I] a propylene polymer in an amount of 20 to 99 mass %, and [II] an adhesive capacity applying resin in an amount of 80 to 1 mass %, wherein [I] the propylene polymer satisfies the requirements of (1) a meso pentad fraction (mmmm) is from 0.2 to 0.6; and (2) a racemic pentad fraction (rrrr) and (1−mmmm) satisfy the relation: [rrrr/(1−mmmm)]≦0.1. The polyolefin resin for hot melt adhesives is superior in thermostability or flowing ability at high-temperature, easy for coating, environmentally friendly with little fear of generating toxic gas in the disposal and incineration, superior in adhesive property to lowly polar substances and in heat resistance of the adhesion face.
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