发明授权
- 专利标题： Package for opto-electrical components
- 专利标题（中）： 光电元件封装
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申请号： US10256173申请日： 2002-09-27
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公开(公告)号： US06797989B2公开(公告)日： 2004-09-28
- 发明人: Giampaolo Bendelli , Enrico Di Mascio , Piero Gambini , Mario Puleo , Marco Scofet , Ian Smith
- 申请人： Giampaolo Bendelli , Enrico Di Mascio , Piero Gambini , Mario Puleo , Marco Scofet , Ian Smith
- 优先权： EP01308247 20010927
- 主分类号： H01L2715
- IPC分类号： H01L2715
摘要：
A package for opto-electrical components includes a casing having a chamber for at least one board or tile adapted to carry the opto-electrical components. The casing includes a set of electrical connections including at least one radio-frequency differential line between the chamber and the casing exterior.
公开/授权文献
- US20030057508A1 Package for opto-electrical components 公开/授权日：2003-03-27
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