发明授权
- 专利标题: Inspection method and its apparatus, inspection system
- 专利标题(中): 检验方法及其装置,检验制度
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申请号: US10241589申请日: 2002-09-12
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公开(公告)号: US06799130B2公开(公告)日: 2004-09-28
- 发明人: Takafumi Okabe , Shunji Maeda , Kaoru Sakai
- 申请人: Takafumi Okabe , Shunji Maeda , Kaoru Sakai
- 优先权: JP2001-278750 20010913
- 主分类号: G01N3700
- IPC分类号: G01N3700
摘要:
The present invention relates to a tool for analyzing by priority a defect having a high possibility of causing an electrical failure when inspecting a particle and a pattern defect in a piece of work which constitutes an electronic device such as a semiconductor integrated circuit, and relates to a system therefor. On the basis of the result of comparison between defect information which is the result of inspection by an inspection tool and layout data stored in an auxiliary storage device, or on the basis of the result of reinspection by comparison between a defect and a wiring pattern as a background by an inspection processing operation unit, an object to be reviewed is selected using review conditions stored in the auxiliary storage device.
公开/授权文献
- US20030050761A1 Inspection method and its apparatus, inspection system 公开/授权日:2003-03-13
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