Invention Grant
- Patent Title: Method for the manufacture of a metal structure and device for wetting a metal structure with an adhesive
- Patent Title (中): 用于制造用粘合剂润湿金属结构的金属结构和装置的方法
-
Application No.: US10273523Application Date: 2002-10-18
-
Publication No.: US06811071B2Publication Date: 2004-11-02
- Inventor: Hans-Peter Caspar , Ferdi Kurth , Michael Voit , Christoph Müller , Alexander Scholz
- Applicant: Hans-Peter Caspar , Ferdi Kurth , Michael Voit , Christoph Müller , Alexander Scholz
- Priority: DE10151487 20011018
- Main IPC: B23K3102
- IPC: B23K3102

Abstract:
A method for manufacturing a metal structure in which the metal structure has separate walls forming channels through which a fluid can flow includes at least partially wetting the walls inside the channels with an adhesive, bringing the metal structure into contact with a solder that adheres to the adhesive, and carrying out a heat treatment to form soldered connections between the separate walls. The method is distinguished by the fact that the dosed delivery of the adhesive is performed by at least one dosing element having a honeycomb configuration and having an inlet side (8) and an outlet side, the element being connected to the adhesive. The adhesive enters the dosing element through the inlet side and is uniformly distributed into the channels through the outlet side. The invention also includes a device for wetting the metal structure with the adhesive.
Public/Granted literature
Information query