- 专利标题： Polishing composition containing conducting polymer
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申请号： US10199704申请日： 2002-07-19
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公开(公告)号： US06811474B2公开(公告)日： 2004-11-02
- 发明人: Isaac K. Cherian , Jian Zhang , Fred Sun , Shumin Wang , Eric H. Klingenberg
- 申请人： Isaac K. Cherian , Jian Zhang , Fred Sun , Shumin Wang , Eric H. Klingenberg
- 主分类号： B24B500
- IPC分类号： B24B500
摘要：
The invention provides a polishing system comprising (a) an abrasive, a polishing pad, a means for oxidizing a substrate, or any combination thereof, (b) a conducting polymer having an electrical conductivity of about 10−10 S/cm to about 106 S/cm, and (c) a liquid carrier.
公开/授权文献
- US20040014400A1 Polishing composition containing conducting polymer 公开/授权日：2004-01-22
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