发明授权
US06812810B2 Bridges for microelectromechanical structures 有权
微机电结构桥梁

  • 专利标题: Bridges for microelectromechanical structures
  • 专利标题(中): 微机电结构桥梁
  • 申请号: US10174935
    申请日: 2002-06-19
  • 公开(公告)号: US06812810B2
    公开(公告)日: 2004-11-02
  • 发明人: Qing MaTsung-Kuan Allen Chou
  • 申请人: Qing MaTsung-Kuan Allen Chou
  • 主分类号: H01P512
  • IPC分类号: H01P512
Bridges for microelectromechanical structures
摘要:
A conductive bridge in a second conductive layer may be utilized to join a pair of spaced apart conductive strips in a first conductive layer. A gap between the first and second strips may be bridged by the bridge while isolating both the first and second strips and the bridge itself from another conductor which extends through the gap between the first and second strips.
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