发明授权
- 专利标题: Bridges for microelectromechanical structures
- 专利标题(中): 微机电结构桥梁
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申请号: US10174935申请日: 2002-06-19
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公开(公告)号: US06812810B2公开(公告)日: 2004-11-02
- 发明人: Qing Ma , Tsung-Kuan Allen Chou
- 申请人: Qing Ma , Tsung-Kuan Allen Chou
- 主分类号: H01P512
- IPC分类号: H01P512
摘要:
A conductive bridge in a second conductive layer may be utilized to join a pair of spaced apart conductive strips in a first conductive layer. A gap between the first and second strips may be bridged by the bridge while isolating both the first and second strips and the bridge itself from another conductor which extends through the gap between the first and second strips.
公开/授权文献
- US20030234703A1 Bridges for microelectromechanical structures 公开/授权日:2003-12-25
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