Tapered waveguide interconnection structure and method of fabricating the same

Invention Grant

US06813417B2 Tapered waveguide interconnection structure and method of fabricating the same 有权

Title translation: 锥形波导互连结构及其制造方法

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Patent Title: Tapered waveguide interconnection structure and method of fabricating the same
Patent Title (中): 锥形波导互连结构及其制造方法
Application No.: US10081976

Application Date: 2002-02-20
Publication No.: US06813417B2

Publication Date: 2004-11-02
Inventor: Min-Cheol Oh , Harold R. Fetterman , William Steier , Joseph Michael
Applicant: Min-Cheol Oh , Harold R. Fetterman , William Steier , Joseph Michael
Main IPC: G02B626
IPC: G02B626

Tapered waveguide interconnection structure and method of fabricating the same

Abstract:

A tapered electrooptic (EO) polymer waveguide interconnection structure coupling an EO polymer waveguide and a passive polymer waveguide and a method of fabricating the same.

Abstract(Chinese):

耦合EO聚合物波导和无源聚合物波导的锥形电光（EO）聚合物波导互连结构及其制造方法。

Public/Granted literature

US20030156794A1 Tapered waveguide interconnection structure and method of fabricating the same Public/Granted day:2003-08-21

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