发明授权
- 专利标题： Electronic part
- 专利标题（中）： 电子部件
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申请号： US10240513申请日： 2003-04-22
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公开(公告)号： US06815834B2公开(公告)日： 2004-11-09
- 发明人: Kazunobu Shimoe , Mitsuo Takeda , Toshiaki Takata , Norihiko Takada
- 申请人： Kazunobu Shimoe , Mitsuo Takeda , Toshiaki Takata , Norihiko Takada
- 优先权： JP2001-022148 20010130; JP2001-281918 20010917
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
An electronic component includes an electronic element and a substrate to which the electronic element is mounted, the electronic element and the substrate being electrically or mechanically connected to each other by at least three bumps. Both the value obtained by dividing the total bonding-area of the bumps bonded to the electronic element by the mass of the electronic element and the value obtained by dividing the total bonding-area of the bumps bonded to the substrate by the mass of the electronic element are at least about 8.8 mm2/g.
公开/授权文献
- US20030160334A1 Electronic part 公开/授权日：2003-08-28