公开(公告)号：US08461940B2

公开(公告)日：2013-06-11

申请号：US12850725

申请日：2010-08-05

申请人： Norihiko Takada ,  Atsushi Kadoi ,  Hayami Kudo

发明人： Norihiko Takada ,  Atsushi Kadoi ,  Hayami Kudo

IPC分类号： H03H9/00 ,  H03H9/15 ,  H03H9/25

CPC分类号： H03H3/00 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05569 ,  H01L2224/0558 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2924/16235 ,  H01L2924/181 ,  H03H9/0523 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/105 ,  H03H9/1085 ,  H03H9/1092 ,  Y10T29/49005 ,  Y10T29/49124 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An elastic wave device has a structure that prevents flux from flowing into a hollow space of the device during mounting of the device using solder bumps. The elastic wave device includes a substrate, a vibrating portion located on a first main surface of the substrate, pads located on the first main surface of the substrate and electrically connected to electrodes of the vibrating portion, a supporting layer arranged on the first main surface of the substrate so as to enclose the vibrating portion, a sheet-shaped cover layer composed of resin including synthetic rubber and disposed on the supporting layer so as to form a hollow space around the periphery of the vibrating portion, a protective layer composed of resin having resistance to flux and disposed on a side of the cover layer remote from the supporting layer, via conductors extending through the protective layer, the cover layer, and the supporting layer and connected to the pads, and external electrodes including solder bumps, disposed at ends of the via conductors adjacent to the protective layer.

摘要翻译： 弹性波装置具有这样的结构，即在使用焊料凸块安装装置期间防止焊剂流入装置的中空空间。 弹性波装置包括基板，位于基板的第一主表面上的振动部分，位于基板的第一主表面上的焊盘，电连接到振动部分的电极，支撑层布置在第一主表面上 以包围振动部分的方式形成由包括合成橡胶的树脂构成的片状覆盖层，并设置在支撑层上，以在振动部分的周围形成中空空间，由树脂构成的保护层 具有抵抗磁通的能力并且设置在远离支撑层的覆盖层的一侧，通过延伸穿过保护层，覆盖层和支撑层并连接到焊盘的导体，以及包括焊料凸块的外部电极， 通孔导体的与保护层相邻的端部。

公开(公告)号：US08072118B2

公开(公告)日：2011-12-06

申请号：US12878175

申请日：2010-09-09

申请人： Ryoichi Omote ,  Norihiko Takada

发明人： Ryoichi Omote ,  Norihiko Takada

IPC分类号： H03H9/25 ,  H01L41/053

CPC分类号： H03H9/059 ,  H03H9/1092

摘要： A highly reliable surface acoustic wave device includes wiring lines that do not easily rupture at a three-dimensional wiring portion. The surface acoustic wave device includes a plurality of surface acoustic wave elements located on a piezoelectric substrate, a supporting member arranged on the piezoelectric substrate so as to enclose vibrating portions including electrodes such as IDT electrodes, and a cover member stacked so as to cover openings of the supporting member and to define hollow spaces facing vibrating electrodes. Furthermore, a three-dimensional wiring portion at which a first wiring line and a second wiring line are stacked with an insulating layer interposed therebetween is provided on the piezoelectric substrate. The three-dimensional wiring portion is enclosed by the supporting member, and thereby disposed inside a space enclosed by the piezoelectric substrate, the supporting member, and the cover member.

摘要翻译： 高度可靠的表面声波装置包括在三维布线部分不容易破裂的布线。 表面声波装置包括位于压电基板上的多个声表面波元件，配置在压电基板上的支撑构件，以包围包括诸如IDT电极的电极的振动部分，以及覆盖部件，以覆盖开口 并且限定面向振动电极的中空空间。 此外，在压电基板上设置有三维布线部分，其中第一布线和第二布线层叠有绝缘层。 三维布线部分由支撑构件包围，从而设置在由压电基板，支撑构件和盖构件包围的空间内。

公开(公告)号：US20100289600A1

公开(公告)日：2010-11-18

申请号：US12850725

申请日：2010-08-05

申请人： Norihiko TAKADA ,  Atsushi KADOI ,  Hayami KUDO

发明人： Norihiko TAKADA ,  Atsushi KADOI ,  Hayami KUDO

IPC分类号： H03H9/15 ,  H03H3/08

CPC分类号： H03H3/00 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05569 ,  H01L2224/0558 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2924/16235 ,  H01L2924/181 ,  H03H9/0523 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/105 ,  H03H9/1085 ,  H03H9/1092 ,  Y10T29/49005 ,  Y10T29/49124 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An elastic wave device has a structure that prevents flux from flowing into a hollow space of the device during mounting of the device using solder bumps. The elastic wave device includes a substrate, a vibrating portion located on a first main surface of the substrate, pads located on the first main surface of the substrate and electrically connected to electrodes of the vibrating portion, a supporting layer arranged on the first main surface of the substrate so as to enclose the vibrating portion, a sheet-shaped cover layer composed of resin including synthetic rubber and disposed on the supporting layer so as to form a hollow space around the periphery of the vibrating portion, a protective layer composed of resin having resistance to flux and disposed on a side of the cover layer remote from the supporting layer, via conductors extending through the protective layer, the cover layer, and the supporting layer and connected to the pads, and external electrodes including solder bumps, disposed at ends of the via conductors adjacent to the protective layer

摘要翻译： 弹性波装置具有这样的结构，即在使用焊料凸块安装装置期间防止焊剂流入装置的中空空间。 弹性波装置包括基板，位于基板的第一主表面上的振动部分，位于基板的第一主表面上的焊盘，电连接到振动部分的电极，支撑层布置在第一主表面上 以包围振动部分的方式形成由包括合成橡胶的树脂构成的片状覆盖层，并设置在支撑层上，以在振动部分的周围形成中空空间，由树脂构成的保护层 具有抵抗磁通的能力并且设置在远离支撑层的覆盖层的一侧，通过延伸穿过保护层，覆盖层和支撑层并连接到焊盘的导体，以及包括焊料凸块的外部电极， 通孔导体的与保护层相邻的端部

公开(公告)号：US06940369B2

公开(公告)日：2005-09-06

申请号：US10438919

申请日：2003-05-16

申请人： Norihiko Nakahashi ,  Masaru Yata ,  Norihiko Takada

发明人： Norihiko Nakahashi ,  Masaru Yata ,  Norihiko Takada

IPC分类号： H03H9/25 ,  H03H9/00 ,  H03H9/64

CPC分类号： H03H9/0071 ,  H03H9/0085 ,  H03H9/1071

摘要： A surface acoustic wave filter has one or more surface acoustic wave filter elements having at least two comb-shaped electrode portions disposed along a propagation direction of a surface acoustic wave and first and second balanced terminals connected to the comb-shaped electrode portions provided on a piezoelectric substrate. The surface acoustic wave filter is housed in a packaging member such that the difference in capacitance between electrodes on the piezoelectric substrate, which are connected to the first and second balanced terminals, is greatly reduced.

摘要翻译： 表面声波滤波器具有一个或多个表面声波滤波器元件，其具有沿声表面波的传播方向布置的至少两个梳状电极部分，以及连接到设置在一个或多个梳状电极部分上的梳状电极部分的第一和第二平衡端子 压电基片。 表面声波滤波器容纳在包装部件中，使得连接到第一和第二平衡端子的压电基板上的电极之间的电容差异大大降低。

公开(公告)号：US06757946B2

公开(公告)日：2004-07-06

申请号：US09801384

申请日：2001-03-08

申请人： Norihiko Takada ,  Hisamitsu Kamenaga ,  Shingo Iwasa

发明人： Norihiko Takada ,  Hisamitsu Kamenaga ,  Shingo Iwasa

IPC分类号： H01L4142

CPC分类号： H01L24/85 ,  B23K20/129 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/16195 ,  H01L2924/20753 ,  H03H3/08 ,  Y10T29/42 ,  Y10T29/49162 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2924/00013

摘要： A wire bonding method for ultrasonically joining two connecting electrodes with a wire includes the steps of forming at least one of the connecting electrodes with tantalum and forming the wire of one of a metallic wire having a fracture load of about 21 g or greater and a metallic wire having a fracture stress of 290 N/mm2 or greater.

摘要翻译： 一种用于将两根连接电极与电线超声波接合的引线接合方法包括以下步骤：用钽形成至少一个连接电极，并形成断裂载荷为约21g或更大的金属线之一和金属线 线断裂应力为290N / mm 2以上。

公开(公告)号：US20130205586A1

公开(公告)日：2013-08-15

申请号：US13571386

申请日：2012-08-10

申请人： Norihiko TAKADA ,  Atsushi KADOI ,  Hayami KUDO

发明人： Norihiko TAKADA ,  Atsushi KADOI ,  Hayami KUDO

IPC分类号： H03H3/00

CPC分类号： H03H3/00 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05569 ,  H01L2224/0558 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2924/16235 ,  H01L2924/181 ,  H03H9/0523 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/105 ,  H03H9/1085 ,  H03H9/1092 ,  Y10T29/49005 ,  Y10T29/49124 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An elastic wave device includes a substrate, a vibrating portion located on a first main surface of the substrate, pads located on the first main surface of the substrate and electrically connected to electrodes of the vibrating portion, a supporting layer arranged on the first main surface of the substrate so as to enclose the vibrating portion, a sheet-shaped cover layer composed of resin including synthetic rubber and disposed on the supporting layer so as to form a hollow space around the periphery of the vibrating portion, a protective layer composed of resin having resistance to flux and disposed on a side of the cover layer remote from the supporting layer, via conductors extending through the protective layer, the cover layer, and the supporting layer and connected to the pads, and external electrodes including solder bumps, disposed at ends of the via conductors adjacent to the protective layer.

摘要翻译： 弹性波装置包括基板，位于基板的第一主表面上的振动部分，位于基板的第一主表面上的电焊盘，与振动部分的电极电连接，支撑层布置在第一主表面上 以包围振动部分的方式形成由包括合成橡胶的树脂构成的片状覆盖层，并设置在支撑层上，以在振动部分的周围形成中空空间，由树脂构成的保护层 具有抵抗磁通的能力并且设置在远离支撑层的覆盖层的一侧，通过延伸穿过保护层，覆盖层和支撑层并连接到焊盘的导体，以及包括焊料凸块的外部电极， 通孔导体的与保护层相邻的端部。

公开(公告)号：US06557225B2

公开(公告)日：2003-05-06

申请号：US09833396

申请日：2001-04-12

申请人： Toshiaki Takata ,  Shuji Yamato ,  Norihiko Takada

发明人： Toshiaki Takata ,  Shuji Yamato ,  Norihiko Takada

IPC分类号： H04R1700

CPC分类号： H03H9/6483 ,  H03H3/10 ,  H03H9/02921 ,  H04R7/045 ,  Y10T29/42 ,  Y10T29/49004 ,  Y10T29/49005 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49176

摘要： A method of producing a surface acoustic wave device by use of a flip chip process, includes the steps of forming on a piezoelectric substrate at least one interdigital transducer and a plurality of electrode pads electrically connected to the interdigital transducer, forming bumps on the respective electrode pads, and providing an insulating film at a region other than a region where the bumps are formed.

摘要翻译： 一种使用倒装芯片工艺制造表面声波装置的方法包括以下步骤：在压电基板上形成至少一个叉指式换能器和电连接到叉指式换能器的多个电极垫，在相应电极上形成凸块 垫，并且在除了形成凸块的区域之外的区域提供绝缘膜。

公开(公告)号：US07944125B2

公开(公告)日：2011-05-17

申请号：US12813550

申请日：2010-06-11

申请人： Norihiko Takada ,  Hayami Kudo

发明人： Norihiko Takada ,  Hayami Kudo

IPC分类号： H01L41/04 ,  H03H9/25

CPC分类号： H03H9/1092 ,  H03H9/02897 ,  H03H9/1071 ,  Y10T156/1052

摘要： A surface acoustic wave device causing less wear of a dicing blade and causing less drop in a dicing speed is manufactured from a mother laminate with high yield and high precision. The surface acoustic wave device is manufactured by dicing a piezoelectric wafer. The surface acoustic wave device includes a piezoelectric substrate resulting from dicing the piezoelectric wafer, IDT electrodes and pad electrodes located on a top surface of the piezoelectric substrate. A support layer having an opening opened to the IDT electrodes is provided. An outline edge of the support layer is inside an outline edge of the top surface of the piezoelectric substrate. A cover made of an insulating material is disposed on the support layer to close the opening of the support layer. In plan view, the outline edge of the cover is aligned with the outline edge of the piezoelectric substrate.

摘要翻译： 以高产率和高精度从母层压板制造引起切割刀片磨损较小并且切割速度降低较少的表面声波装置。 表面声波装置通过切割压电晶片来制造。 声表面波装置包括压电基片，其压电基片的顶表面上形成压电晶片，IDT电极和焊盘电极。 提供了具有向IDT电极开口的开口的支撑层。 支撑层的轮廓边缘在压电基板的顶表面的轮廓边缘的内侧。 由绝缘材料制成的盖子设置在支撑层上以封闭支撑层的开口。 在平面图中，盖的轮廓边缘与压电基板的轮廓边缘对齐。

公开(公告)号：US20100327694A1

公开(公告)日：2010-12-30

申请号：US12878175

申请日：2010-09-09

申请人： Ryoichi OMOTE ,  Norihiko TAKADA

发明人： Ryoichi OMOTE ,  Norihiko TAKADA

IPC分类号： H01L41/08 ,  H01L41/047

CPC分类号： H03H9/059 ,  H03H9/1092

摘要： A highly reliable surface acoustic wave device includes wiring lines that do not easily rupture at a three-dimensional wiring portion. The surface acoustic wave device includes a plurality of surface acoustic wave elements located on a piezoelectric substrate, a supporting member arranged on the piezoelectric substrate so as to enclose vibrating portions including electrodes such as IDT electrodes, and a cover member stacked so as to cover openings of the supporting member and to define hollow spaces facing vibrating electrodes. Furthermore, a three-dimensional wiring portion at which a first wiring line and a second wiring line are stacked with an insulating layer interposed therebetween is provided on the piezoelectric substrate. The three-dimensional wiring portion is enclosed by the supporting member, and thereby disposed inside a space enclosed by the piezoelectric substrate, the supporting member, and the cover member.

摘要翻译： 高度可靠的表面声波装置包括在三维布线部分不容易破裂的布线。 表面声波装置包括位于压电基板上的多个声表面波元件，配置在压电基板上的支撑构件，以包围包括诸如IDT电极的电极的振动部分，以及覆盖部件，以覆盖开口 并且限定面向振动电极的中空空间。 此外，在压电基板上设置有三维布线部分，其中第一布线和第二布线层叠有绝缘层。 三维布线部分由支撑构件包围，从而设置在由压电基板，支撑构件和盖构件包围的空间内。

公开(公告)号：US20100253182A1

公开(公告)日：2010-10-07

申请号：US12813550

申请日：2010-06-11

申请人： Norihiko TAKADA ,  Hayami Kudo

发明人： Norihiko TAKADA ,  Hayami Kudo

IPC分类号： H01L41/047 ,  H01L41/053 ,  B32B38/10 ,  H01L41/22

CPC分类号： H03H9/1092 ,  H03H9/02897 ,  H03H9/1071 ,  Y10T156/1052

摘要： A surface acoustic wave device causing less wear of a dicing blade and causing less drop in a dicing speed is manufactured from a mother laminate with high yield and high precision. The surface acoustic wave device is manufactured by dicing a piezoelectric wafer. The surface acoustic wave device includes a piezoelectric substrate resulting from dicing the piezoelectric wafer, IDT electrodes and pad electrodes located on a top surface of the piezoelectric substrate. A support layer having an opening opened to the IDT electrodes is provided. An outline edge of the support layer is inside an outline edge of the top surface of the piezoelectric substrate. A cover made of an insulating material is disposed on the support layer to close the opening of the support layer. In plan view, the outline edge of the cover is aligned with the outline edge of the piezoelectric substrate.

摘要翻译： 以高产率和高精度从母层压板制造引起切割刀片磨损较小并且切割速度降低较少的表面声波装置。 表面声波装置通过切割压电晶片来制造。 声表面波装置包括压电基片，其压电基片的顶表面上形成压电晶片，IDT电极和焊盘电极。 提供了具有向IDT电极开口的开口的支撑层。 支撑层的轮廓边缘在压电基板的顶表面的轮廓边缘的内侧。 由绝缘材料制成的盖子设置在支撑层上以封闭支撑层的开口。 在平面图中，盖的轮廓边缘与压电基板的轮廓边缘对齐。