发明授权
US06819547B2 Housing for electronic apparatus having outer wall formed by injection molding
失效
具有通过注射成型形成的外壁的电子设备的外壳
- 专利标题： Housing for electronic apparatus having outer wall formed by injection molding
- 专利标题（中）： 具有通过注射成型形成的外壁的电子设备的外壳
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申请号： US10082709申请日： 2002-02-25
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公开(公告)号： US06819547B2公开(公告)日： 2004-11-16
- 发明人: Hiroyuki Minaguchi , Nobuyasu Tajima , Naohiro Yokoyama , Yasuyuki Suzuki
- 申请人： Hiroyuki Minaguchi , Nobuyasu Tajima , Naohiro Yokoyama , Yasuyuki Suzuki
- 优先权： JP2001-063960 20010307
- 主分类号： G06F116
- IPC分类号： G06F116
摘要：
The housing used in the electronic apparatus has an outer wall. The outer wall is formed by injecting a metal material from a plurality of gates into a molding space in a metal die. The outer wall includes a first end portion situated on an upstream end along a flowing direction of the metal material, a second end portion situated on a downstream end of the flowing direction of the metal material, and an injection portion formed on the first end portion where the plurality of gates of the metal die are situated, forming a space between the first end portion and the injection portion.
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