Optical switch packaging techniques and optical switch components are described. In one aspect, an optical switch component that includes a die mounted on an interposer is described. The die has an exposed array of mirrors that can be used as part of an optical switch. Typically, the interposer will also have a fiber array mount arranged to receive a fiber bundle and to position the fiber bundle appropriately over the array of mirrors. In some embodiments, an optical switch can be formed by putting together two mirror image interposer based optical switch components. When placing two interposer based optical switch components together, an alignment frame may be positioned between the interposers to help maintain a desired spacing between the respective arrays of mirrors. In some such embodiments, an inner housing is provided that encloses the dice, the fiber array mounts the alignment frame and portions of the interposers, but leaves connectors mounted on the interposers exposed. An outer housing may optionally be provided to encase the optical switch components and the inner housing. A resilient filler material may also be provided between the inner and outer housings to provide additional protection to the optical switch.