A package for opto-electrical components, includes a casing having (1) a chamber and (2) at least one board or tile for carrying the opto-electrical components. The casing has an opening (shaped as a parallelogram) defining an optical feed-through path between the chamber and the outside of the casing. The casing includes ceramic material in the vicinity of the opening. An adapter associated with the opening has a substantially circular aperture to accept a fiber pigtail and/or a fiber optic connector.