发明授权
- 专利标题: Thermal control of a DUT using a thermal control substrate
- 专利标题(中): 使用热控制基板进行DUT的热控制
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申请号: US10197880申请日: 2002-07-19
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公开(公告)号: US06825681B2公开(公告)日: 2004-11-30
- 发明人: Jan Feder , Rick Beyerle , Stephen Byers , Thomas Jones
- 申请人: Jan Feder , Rick Beyerle , Stephen Byers , Thomas Jones
- 主分类号: G01R3126
- IPC分类号: G01R3126
摘要:
A solid state thermal control device contains a substrate and a plurality of solid state thermal elements on the substrate. The thermal elements are adapted to provide thermal control to a device under test (DUT). Each solid state thermal element contains at least one solid state heater and an active control circuit adapted to control a thermal output of the heater. Optionally, the each thermal element may also include a solid state temperature sensor.
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