Invention Grant
- Patent Title: Droplet plate architecture
- Patent Title (中): 液滴板结构
-
Application No.: US10643264Application Date: 2003-08-19
-
Publication No.: US06837572B2Publication Date: 2005-01-04
- Inventor: Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
- Applicant: Ravi Ramaswami , Victor Joseph , Colin C. Davis , Ronnie J. Yenchik , Daniel A. Kearl , Martha A. Truninger , Roberto A. Pugliese, Jr. , Ronald L. Enck
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J2/16
- IPC: B41J2/16
Abstract:
A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.
Public/Granted literature
- US20040032456A1 Droplet plate architecture Public/Granted day:2004-02-19
Information query
IPC分类:
