Invention Grant
- Patent Title: VIA0 etch process for FRAM integration
- Patent Title (中): 用于FRAM集成的VIA0蚀刻工艺
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Application No.: US10440697Application Date: 2003-05-19
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Publication No.: US06841396B2Publication Date: 2005-01-11
- Inventor: Francis Gabriel Celii , K. R. Udayakumar , Scott R. Summerfelt , Theodore S. Moise
- Applicant: Francis Gabriel Celii , K. R. Udayakumar , Scott R. Summerfelt , Theodore S. Moise
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; W. James Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/20 ; H01L21/8242 ; H01L21/8246 ; H01L27/115

Abstract:
A ferroelectric memory device comprises a logic programmable capacitance reference circuit. The circuit is adapted to generate a reference voltage during a sense mode of operation, wherein the reference voltage comprises a value that is a function of one more memory conditions. The memory device further comprises a bit line pair, wherein a first bit line of the bit line pair has a ferroelectric capacitor coupled thereof for sensing thereof, and a second bit line of the bit line pair is coupled to the reference voltage. A sense circuit is coupled to the bit line pair and is configured to detect a data state associated with the ferroelectric capacitor using a voltage associated with the first bit line and reference voltage on the second bit line.
Public/Granted literature
- US20040235259A1 VIA0 ETCH PROCESS FOR FRAM INTEGRATION Public/Granted day:2004-11-25
Information query
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