An integrated circuit for wireless communications includes substrate, at least one integrated antenna formed in or on the substrate, and a heat sink. At least one dielectric propagating layer is disposed between the integrated antenna and the heat sink which provides a thermal conductivity of at least 35 W/m·K and resistivity greater than 100 Ohm-cm at 25 C. The invention can be used to establish an on-chip or inter-chip wireless link over at least a 2.2 cm distance.