发明授权
- 专利标题： Semiconductor device having a bond pad and method therefor
- 专利标题（中）： 具有接合焊盘的半导体器件及其方法
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申请号： US10097036申请日： 2002-03-13
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公开(公告)号： US06844631B2公开(公告)日： 2005-01-18
- 发明人: Lois E. Yong , Peter R. Harper , Tu Anh Tran , Jeffrey W. Metz , George R. Leal , Dieu Van Dinh
- 申请人： Lois E. Yong , Peter R. Harper , Tu Anh Tran , Jeffrey W. Metz , George R. Leal , Dieu Van Dinh
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 代理商 Daniel D. Hill; James L. Clingan, Jr.
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; H01L21/60 ; H01L23/485 ; H01L23/58 ; H01L29/40
摘要：
A bond pad (10) has a probe region (14) and a wire bond region (12) that are substantially non-overlapping. In one embodiment, the bond pad (10) is connected to a final metal layer pad (16) and extends over an interconnect region (24). The bond pad (10) is formed from aluminum and the final metal layer pad (16) is formed from copper. Separating the probe region (14) from the wire bond region (12) prevents the final metal layer pad (16) from being damaged by probe testing, allowing for more reliable wire bonds. In an application requiring very fine pitch between bond pads, the probe regions (14) and active regions (12) of a plurality of bond pads formed in a line may be staggered to increase the distance between the probe regions (14). In addition, forming the bond pads (10) over the interconnect region (24) reduces the size of the integrated circuit.
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