发明授权
- 专利标题： Method for connection of circuit units
- 专利标题（中）： 电路单元连接方法
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申请号： US10298837申请日： 2002-11-18
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公开(公告)号： US06845554B2公开(公告)日： 2005-01-25
- 发明人: Gerd Frankowsky , Harry Hedler , Roland Irsigler , Thorsten Meyer , Barbara Vasquez
- 申请人： Gerd Frankowsky , Harry Hedler , Roland Irsigler , Thorsten Meyer , Barbara Vasquez
- 申请人地址： DE München
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE München
- 代理机构： Jenkins, Wilson & Taylor, P.A.
- 优先权： DE10157280 20011122
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/60 ; H01L21/78 ; H05K3/30
摘要：
The invention creates a method for connection of circuit units (101a-10n) which are arranged on a wafer (100), in which the wafer (100) is fitted to a first film (102a), the wafer (100) is sawn such that the circuit units (101a-101n) which are arranged on the wafer (100) are separated, the functional circuit units (101d) are picked up by means of a handling device (101) and are placed down on a second film (102b) by means of the handling device (103), so as to produce a separation distance which can be predetermined between connection contacts of the circuit units (101d).
公开/授权文献
- US20030110628A1 Method for connection of circuit units 公开/授权日：2003-06-19
信息查询
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