The present invention provides a method of manufacturing a low-temperature sintering multilayer ceramic wiring board comprising the steps of: forming a wiring layer by printing conductive paste (4) on an unfired green sheet (1); forming a laminate by laminating, on at least one side of a ceramic substrate, the unfired green sheet having the wiring layer; and firing the laminate. The present invention also provides paste for use with this method. In the firing step, after an adhesive layer (8) or binder resin in said green sheet used for lamination burns, glass ceramic in the green sheet starts to sinter, and upon or after the start of sintering of the glass ceramic, conductive particles in the conductive paste starts to sinter. This manufacturing method can provide an precise wiring board without pattern deformation and also provide a low-temperature ceramic multilayer wiring board that has no cracks in the glass ceramic on the periphery of electrodes and has electrodes of a dense film structure.