公开(公告)号：US06846375B2

公开(公告)日：2005-01-25

申请号：US09979018

申请日：2001-03-15

申请人： Masaaki Hayama ,  Kazuhiro Miura ,  Akira Hashimoto ,  Takeo Yasuho

发明人： Masaaki Hayama ,  Kazuhiro Miura ,  Akira Hashimoto ,  Takeo Yasuho

IPC分类号： H01L21/48 ,  H05K3/46 ,  B32B31/26

CPC分类号： H01L21/4857 ,  H01L21/4867 ,  H05K3/4664

摘要： The present invention provides a method of manufacturing a low-temperature sintering multilayer ceramic wiring board comprising the steps of: forming a wiring layer by printing conductive paste (4) on an unfired green sheet (1); forming a laminate by laminating, on at least one side of a ceramic substrate, the unfired green sheet having the wiring layer; and firing the laminate. The present invention also provides paste for use with this method. In the firing step, after an adhesive layer (8) or binder resin in said green sheet used for lamination burns, glass ceramic in the green sheet starts to sinter, and upon or after the start of sintering of the glass ceramic, conductive particles in the conductive paste starts to sinter. This manufacturing method can provide an precise wiring board without pattern deformation and also provide a low-temperature ceramic multilayer wiring board that has no cracks in the glass ceramic on the periphery of electrodes and has electrodes of a dense film structure.

摘要翻译： 本发明提供一种制造低温烧结多层陶瓷布线板的方法，包括以下步骤：通过在未烧成的生片（1）上印刷导电浆料（4）形成布线层; 在陶瓷基板的至少一侧层叠具有布线层的未烧成的生片，形成层叠体; 并烧制层压板。 本发明还提供了用于该方法的糊剂。 在烧成工序中，在用于层压燃烧的所述生片中的粘合剂层（8）或粘合剂树脂后，生片中的玻璃陶瓷开始烧结，玻璃陶瓷的烧结开始或之后，导电粒子 导电膏开始烧结。 该制造方法可以提供没有图案变形的精确布线板，并且还提供在电极周边的玻璃陶瓷中没有裂纹并且具有致密膜结构的电极的低温陶瓷多层布线板。

公开(公告)号：US06372158B1

公开(公告)日：2002-04-16

申请号：US09696687

申请日：2000-10-26

申请人： Akira Hashimoto ,  Takeo Yasuho ,  Masaaki Hayama ,  Kazuhiro Miura

发明人： Akira Hashimoto ,  Takeo Yasuho ,  Masaaki Hayama ,  Kazuhiro Miura

IPC分类号： H01B122

CPC分类号： H05K1/092 ,  H01B1/22

摘要： A paste of the present invention comprises a precious metal organic acid salt added to precious metal powder as a precious metal component of the conductive paste. The base metal organic acid salts are also used instead of base metal components in the inorganic binders to exclude particles with larger diameters from the conductive paste. The conductive paste of the present invention allows the lumps in the paste caused by the insufficient dispersion to be 10 &mgr;m &PHgr; or less, thereby remarkably reducing the screen blockage during screen printing of wiring pattern of 100 &mgr;m or less in width.

摘要翻译： 本发明的糊剂包含贵金属有机酸盐，作为导电浆料的贵金属成分添加到贵金属粉末中。 也可以使用贱金属有机酸盐代替无机粘合剂中的贱金属成分，以从导电糊中排除具有较大直径的颗粒。 本发明的导电性糊料使由分散不充分引起的糊状物块为10μm＆amp; PHgr; 以下，在丝网印刷期间显着降低宽度为100μm以下的布线图案的屏幕堵塞。

公开(公告)号：US20100025099A1

公开(公告)日：2010-02-04

申请号：US12461320

申请日：2009-08-07

申请人： Toshio Sugawa ,  Satoshi Murakawa ,  Masaaki Hayama ,  Takeo Yasuho

发明人： Toshio Sugawa ,  Satoshi Murakawa ,  Masaaki Hayama ,  Takeo Yasuho

IPC分类号： H05K1/02 ,  H05K3/10

CPC分类号： H05K3/4069 ,  H05K1/095 ,  H05K2201/0305 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T428/24917

摘要： A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

摘要翻译： 通过用导电材料填充形成在绝缘基板中的通孔来制造电路板，在绝缘基板的两侧设置导电层，以及将导电材料的组分材料的合金与导电层的成分材料形成。 因此，在电路板中，填充在形成于绝缘基板上的通路孔中的导电材料与绝缘基板两侧的导电层电连接并且机械地牢固地连接在一起，具有高可靠性。

公开(公告)号：US07180012B2

公开(公告)日：2007-02-20

申请号：US10493437

申请日：2003-08-25

申请人： Michiaki Tsuneoka ,  Koji Hashimoto ,  Masaaki Hayama ,  Takeo Yasuho

发明人： Michiaki Tsuneoka ,  Koji Hashimoto ,  Masaaki Hayama ,  Takeo Yasuho

IPC分类号： H01L23/28

CPC分类号： H01L23/3121 ,  H01L23/13 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/403 ,  H01L2924/00

摘要： A module component with a good shield effect and a low height including a circuit board having mounted thereon a mount device including an electronic part. The device is sealed with a sealing body having a metal film formed on the sealing body surface. A ground pattern is formed at the outer periphery of the principal surface of the circuit board. The metal film is conductively connected with the ground pattern.

摘要翻译： 具有良好屏蔽效果和低高度的模块部件，包括其上安装有包括电子部件的安装装置的电路板。 该装置用形成在密封体表面上的金属膜的密封体密封。 在电路板的主表面的外周形成接地图案。 金属膜与接地图形导电连接。

公开(公告)号：US07161252B2

公开(公告)日：2007-01-09

申请号：US10485540

申请日：2003-06-16

申请人： Michiaki Tsuneoka ,  Koji Hashimoto ,  Masaaki Hayama ,  Takeo Yasuho

发明人： Michiaki Tsuneoka ,  Koji Hashimoto ,  Masaaki Hayama ,  Takeo Yasuho

IPC分类号： H01L23/28

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L23/60 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H01L2224/29075 ,  H01L2924/00014

摘要： A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected on the circuit board, and a metal film covering the sealer and connected to the grounding pattern. The dimension of the first dealer is smaller than an outside dimension of the circuit board. The first sealer is made of first resin and sealing the component. The module has a low profile and is adequately shielded.

摘要翻译： 模块包括部件，具有安装在其上的部件的电路板，形成在电路板的表面部分的最外周上的第一接地图案​​; 设置在电路板上并具有投影在电路板上的尺寸的第一密封器，以及覆盖密封件并连接到接地图案的金属膜。 第一经销商的尺寸小于电路板的外部尺寸。 第一个封口机由第一个树脂制成并密封组件。 该模块具有低外形并且被充分屏蔽。

公开(公告)号：US20050017740A1

公开(公告)日：2005-01-27

申请号：US10488552

申请日：2003-02-19

申请人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

发明人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H05K1/18 ,  H05K3/46 ,  G01R31/02

CPC分类号： G01R31/02 ,  G01R31/28 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/16 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0723 ,  H05K2203/063 ,  H05K2203/1147 ,  H05K2203/167 ,  H05K2203/171 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

摘要翻译： 一种模块部件，其包括在至少一个表面上具有一个或多个部件1的电路基板3，以及具有中空部分4或孔的接合电路基板5，其对应于安装在一个或多个部件上的一个或多个部件1的部分 用于安装安装部件1的电路基板3的表面。这些基板被层压以形成单体，使得安装的部件1被包含在内部。 上述配置确保了层间连接的高可靠性，并且能够以高尺寸精度密集地安装多个部件。 因此，提供了高度可靠的紧凑模块组件。

公开(公告)号：US07423222B2

公开(公告)日：2008-09-09

申请号：US10203970

申请日：2002-01-11

申请人： Toshio Sugawa ,  Satoshi Murakawa ,  Masaaki Hayama ,  Takeo Yasuho

发明人： Toshio Sugawa ,  Satoshi Murakawa ,  Masaaki Hayama ,  Takeo Yasuho

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： H05K3/4069 ,  H05K1/095 ,  H05K2201/0305 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T428/24917

摘要： A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

摘要翻译： 通过用导电材料填充形成在绝缘基板中的通孔来制造电路板，在绝缘基板的两侧设置导电层，以及将导电材料的组分材料的合金与导电层的成分材料形成。 因此，在电路板中，填充在形成于绝缘基板上的通路孔中的导电材料与绝缘基板两侧的导电层电连接并且机械地牢固地连接在一起，具有高可靠性。

公开(公告)号：US07161371B2

公开(公告)日：2007-01-09

申请号：US10488552

申请日：2003-02-19

申请人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

发明人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

IPC分类号： G01R31/02

CPC分类号： G01R31/02 ,  G01R31/28 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/16 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0723 ,  H05K2203/063 ,  H05K2203/1147 ,  H05K2203/167 ,  H05K2203/171 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

摘要翻译： 一种模块部件，其包括在至少一个表面上具有一个或多个部件1的电路基板3，以及具有中空部分4或孔的接合电路基板5，其对应于安装在一个或多个部件上的一个或多个部件1的部分 用于安装安装部件1的电路基板3的表面。这些基板被层压以形成单体，使得安装的部件1被包含在内部。 上述配置确保了层间连接的高可靠性，并且能够以高尺寸精度密集地安装多个部件。 因此，提供了高度可靠的紧凑型模块组件。

公开(公告)号：US07382628B2

公开(公告)日：2008-06-03

申请号：US10499036

申请日：2003-09-04

申请人： Eiji Kawamoto ,  Masaaki Hayama ,  Masaaki Katsumata ,  Hiroki Yabe ,  Takeo Yasuho

发明人： Eiji Kawamoto ,  Masaaki Hayama ,  Masaaki Katsumata ,  Hiroki Yabe ,  Takeo Yasuho

IPC分类号： H05K1/18

CPC分类号： H05K3/284 ,  H01L2924/15311 ,  H05K1/0218 ,  H05K1/141 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/10636 ,  Y02P70/611

摘要： A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes.A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).

摘要翻译： 提供了一种电路部件内置模块，其中当电路部件内置模块通过使用焊料安装在母板上时被重新熔化的焊料被防止流向规定电极的外部。 第一凹槽（116）形成在位于电路部件（104）所连接的两个电极（103）之间的阻焊剂（106）中。 使用其中第一凹槽（116）和电路部件（104）之间的空间填充有第一绝缘树脂（107）的构造。

公开(公告)号：US20070182000A1

公开(公告)日：2007-08-09

申请号：US11650976

申请日：2007-01-09

申请人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

发明人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

IPC分类号： H01L23/34

CPC分类号： G01R31/02 ,  G01R31/28 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/16 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0723 ,  H05K2203/063 ,  H05K2203/1147 ,  H05K2203/167 ,  H05K2203/171 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

摘要翻译： 一种模块部件，其包括在至少一个表面上具有一个或多个部件1的电路基板3，以及具有中空部分4或孔的接合电路基板5，其对应于安装在一个或多个部件上的一个或多个部件1的部分 用于安装安装部件1的电路基板3的表面。这些基板被层压以形成单体，使得安装的部件1被包含在内部。 上述配置确保了层间连接的高可靠性，并且能够以高尺寸精度密集地安装多个部件。 因此，提供了高度可靠的紧凑型模块组件。