Disclosed are non-flammable, high-solvency compositions having utility as cleaning agents in the electronics and refrigeration industries, and as a medium for mold release agents. The compositions are non-flammable by Flame Extension Test ASTM D-3065 and Flash Point-Tag Closed Cup Test ASTM D-56-82, and have a Kauri Butanol value of at least about 40 by ASTM 1133-94. The compositions comprise the components: a.) trans-1,2-dichloroethylene; and b.) solvent selected from: i.) oxygen-containing solvents selected from alcohols, ketones, esters, siloxanes, and ethers; and ii.) hydrocarbon solvents represented by CtH2t+2 or CtH2t, wherein t is from 4 to 8; and c.) an inerting agent selected from: i.) hydrofluorocarbon inerting agents represented by the formula CxHyF(2x+2−y), wherein x is from 3 to 8, y is from 1 to 4, and the mole ratio of F/H in the hydrofluorocarbon inerting agent is greater than 1.6; ii.) hydrofluorocarbon ether inerting agents represented by the formula CrF2r+1OCsH2s+1, wherein r and s are independently selected from 1 to 6, and r is greater than or equal to 2s; and iii.) hydrochlorofluorocarbon inerting agents represented by the formulae C2HCl2F3, C2HClF4, and C3HCl2F5.