发明授权
US06855432B1 Low activation temperature adhesive composition with high peel strength and cohesive failure
有权
低活化温度粘合剂组合物具有高剥离强度和内聚破坏
- 专利标题: Low activation temperature adhesive composition with high peel strength and cohesive failure
- 专利标题(中): 低活化温度粘合剂组合物具有高剥离强度和内聚破坏
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申请号: US10070395申请日: 2000-09-01
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公开(公告)号: US06855432B1公开(公告)日: 2005-02-15
- 发明人: Sassan Hojabr , Stephen Robert Tanny
- 申请人: Sassan Hojabr , Stephen Robert Tanny
- 申请人地址: US DE Wilmington
- 专利权人: E. I. du Pont de Nemours and Company
- 当前专利权人: E. I. du Pont de Nemours and Company
- 当前专利权人地址: US DE Wilmington
- 国际申请: PCTCA00/01017 WO 20000901
- 国际公布: WO0118141 WO 20010315
- 主分类号: B32B15/08
- IPC分类号: B32B15/08 ; C08L23/16 ; C08L25/08 ; C08L51/06 ; C09J123/04 ; C09J123/08 ; C09J123/16 ; B32B27/08
摘要:
The present invention provides a resin composition made from admixing starting materials comprising: (a) 0 to 90 parts by weight of a polyolefin; (b) 5 to 95 parts by weight of a functional polyolefin; (c) 5 to 40 parts by weight of a polystyrenic; and (d) 0 to 30 parts by weight of an elastomer, where the total amount of components of (a), (b), (c) and (d) in the resin composition is 100 parts by weight. In a further embodiment, component (a) is a non-olefin copolymer and component (c) is high impact polystyrene. The resin compositions are useful as adhesives for metal and polyolefin substrates.
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