- 专利标题: Insulated gate type semiconductor device and method for fabricating the same
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申请号: US10046077申请日: 2002-01-16
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公开(公告)号: US06858896B2公开(公告)日: 2005-02-22
- 发明人: Hiroshi Inagawa , Nobuo Machida , Kentaro Oishi
- 申请人: Hiroshi Inagawa , Nobuo Machida , Kentaro Oishi
- 申请人地址: JP Tokyo JP Gunma
- 专利权人: Renesas Technology Corp.,Hitachi Tobu Semiconductor Ltd.
- 当前专利权人: Renesas Technology Corp.,Hitachi Tobu Semiconductor Ltd.
- 当前专利权人地址: JP Tokyo JP Gunma
- 代理机构: Miles & Stockbridge P.C.
- 优先权: JP2001-042352 20010219
- 主分类号: H01L27/06
- IPC分类号: H01L27/06 ; H01L21/331 ; H01L21/336 ; H01L21/8234 ; H01L27/04 ; H01L27/088 ; H01L29/06 ; H01L29/12 ; H01L29/417 ; H01L29/739 ; H01L29/78 ; H01L21/76
摘要:
In an insulated-gate type semiconductor device in which a gate-purpose conductive layer is embedded into a trench which is formed in a semiconductor substrate, and a source-purpose conductive layer is provided on a major surface of the semiconductor substrate, a portion of a gate pillar which is constituted by both the gate-purpose conductive layer and a cap insulating film for capping an upper surface of the gate-purpose conductive layer is projected from the major surface of the semiconductor substrate; a side wall spacer is provided on a side wall of the projected portion of the gate pillar; and the source-purpose conductive layer is connected to a contact region of the major surface of the semiconductor substrate, which is defined by the side wall spacer.
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