发明授权
US06858924B2 Flip-chip semiconductor device having I/O modules in an internal circuit area
有权
在内部电路区域中具有I / O模块的倒装半导体器件
- 专利标题： Flip-chip semiconductor device having I/O modules in an internal circuit area
- 专利标题（中）： 在内部电路区域中具有I / O模块的倒装半导体器件
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申请号： US10445040申请日： 2003-05-27
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公开(公告)号： US06858924B2公开(公告)日： 2005-02-22
- 发明人: Yoshihiro Masumura , Nobuteru Oh , Hiroyuki Furukawa
- 申请人： Yoshihiro Masumura , Nobuteru Oh , Hiroyuki Furukawa
- 申请人地址： JP Kanagawa
- 专利权人： NEC Electronics Corporation
- 当前专利权人： NEC Electronics Corporation
- 当前专利权人地址： JP Kanagawa
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2002-153691 20020528
- 主分类号： H01L21/822
- IPC分类号： H01L21/822 ; H01L21/82 ; H01L23/58 ; H01L27/02 ; H01L27/04 ; H01L27/118 ; H01L23/02
摘要：
A semiconductor device includes an internal circuit area including a plurality of I/O modules, and a peripheral area receiving therein a pair of loop test lines for testing I/O buffers in the I/O modules. The internal test line extending from each of the loop test lines toward the internal circuit area includes an out-module test line formed as the topmost layer, a first in-module test line formed as the topmost layer and connected to the out-module test line, and a second in-module test line, a portion of which is formed by connecting the in-buffer test lines together.
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