发明授权
- 专利标题: Board to board array type connector
- 专利标题(中): 板对板阵列式连接器
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申请号: US10654044申请日: 2003-09-04
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公开(公告)号: US06859370B1公开(公告)日: 2005-02-22
- 发明人: Chien-Yu Hsu , Yen-Jang Liao , Li-Sen Chen
- 申请人: Chien-Yu Hsu , Yen-Jang Liao , Li-Sen Chen
- 申请人地址: TW Taoyuan Hsien
- 专利权人: Speed Tech Corp.
- 当前专利权人: Speed Tech Corp.
- 当前专利权人地址: TW Taoyuan Hsien
- 代理机构: Rabin & Berdo, P.C.
- 主分类号: H01R12/00
- IPC分类号: H01R12/00 ; H01R12/04 ; H01R12/06 ; H01R13/24 ; H01R13/621 ; H05K7/10 ; H05K7/12
摘要:
A board to board array type connector comprising an array type connector, an upper supporting cover, a lower supporting cover, a screw with a bolt and a screw nut; during application, the upper supporting cover is on the top of the upper PCB, the upper pressing area/point presses down on the top of the upper PCB, the lower supporting cover is on the bottom of the lower PCB, the lower pressing area/point presses up on the bottom of the lower PCB; the screw with bolt passes through all the through holes and is fastened with the screw nut on the end to assemble the whole set, the stress is distributed equilibrium to the upper and lower pressing area/point, the pressure is evenly over all the connection pins of the array type connector for better electrical conductivity.
公开/授权文献
- US20050052853A1 BOARD TO BOARD ARRAY TYPE CONNECTOR 公开/授权日:2005-03-10
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