A system of integrating electronic and optical functions includes an electronic chip that also includes monolithic IC electronics for performing electronic functions. Furthermore, the electronic chip includes a plurality of solder bumps for receiving input for processing. An optical chip receives an optical signal and performs optical functions on the signal, and outputs electrical signals indicative of the optical functions performed on the signal. Moreover, the optical chip includes a plurality of solder bumps for sending the electrical signals as input to the electronic chip. The solder bumps of the electronic chip and optical chip are bonded to together so that a hybrid integration is formed that separates the yield of the optical and electrical circuits forming the electronic and optical chip.