- 专利标题： Substrate coating unit and substrate coating method
-
申请号： US10101707申请日： 2002-03-21
-
公开(公告)号： US06860945B2公开(公告)日： 2005-03-01
- 发明人: Shinji Kobayashi , Takahiro Kitano , Masateru Morikawa , Kazuhiro Takeshita , Yoshiyuki Kawafuchi
- 申请人： Shinji Kobayashi , Takahiro Kitano , Masateru Morikawa , Kazuhiro Takeshita , Yoshiyuki Kawafuchi
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP2001-083565 20010322
- 主分类号： H01L21/027
- IPC分类号： H01L21/027 ; H01L21/00 ; B05B15/04 ; B05B3/00 ; B05C5/00
摘要：
The present invention is a coating unit for applying a coating solution to a substrate which includes: a discharge nozzle for reciprocating in a predetermined direction above the substrate and discharging the coating solution to the substrate; a holder for holding the substrate and horizontally movable in one direction perpendicular to the predetermined direction; and a cover for covering an upper face of the substrate when the substrate is moved in the one direction to be more forward than the discharge nozzle as viewed from a plane, wherein a lower face of the cover is inclined such as to be higher on the discharge nozzle side. According to the present invention, the cover covering the upper face of the substrate restrains a solvent from evaporating from the coating solution applied on the substrate to secure flatness of a coating film.
公开/授权文献
- US20020134304A1 Substrate coating unit and substrate coating method 公开/授权日：2002-09-26
信息查询
IPC分类:
