A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is disposed on an exterior surface of the shell and is thermally coupled to the protrusion of the liner. A case is disposed within the liner and is thermally coupled to the liner. The case is adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermally coupled to the case.