发明授权
- 专利标题： Conductive cap, electronic component, and method of forming insulating film of conductive cap
- 专利标题（中）： 导电帽，电子部件和形成导电帽绝缘膜的方法
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申请号： US10192665申请日： 2002-07-11
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公开(公告)号： US06866893B2公开(公告)日： 2005-03-15
- 发明人: Toshiyuki Baba , Toshio Nishimura , Tsuyoshi Kitagawa , Jiro Inoue , Shoichi Kawabata
- 申请人： Toshiyuki Baba , Toshio Nishimura , Tsuyoshi Kitagawa , Jiro Inoue , Shoichi Kawabata
- 申请人地址： JP Kyoto
- 专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人地址： JP Kyoto
- 代理机构： Keating & Bennett, LLP
- 优先权： JP11-231988 19990818; JP11-231989 19990818; JP11-287217 19991007
- 主分类号： H01L41/08
- IPC分类号： H01L41/08 ; H01L21/48 ; H01L23/02 ; H01L23/06 ; H01L23/10 ; B05D3/02
摘要：
A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.
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