发明授权
- 专利标题： Lead frame
- 专利标题（中）： 引线架
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申请号： US10256006申请日： 2002-09-27
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公开(公告)号： US06867507B2公开(公告)日： 2005-03-15
- 发明人: Tetsuya Uebayashi , Shunichi Abe , Naoki Izumi , Akira Yamazaki
- 申请人： Tetsuya Uebayashi , Shunichi Abe , Naoki Izumi , Akira Yamazaki
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2001-299162 20010928
- 主分类号： H01L21/52
- IPC分类号： H01L21/52 ; H01L23/495 ; H01L23/50 ; H01L23/544
摘要：
A section of predetermined geometry and area is provided on or in a die pad of a lead frame and taken as a mark to be used for checking the position of a semiconductor chip. If the semiconductor chip is placed outside an allowable range in the X direction, the semiconductor chip overlaps the mark, thereby changing the geometry of an observable portion (slanted portion) of the mark. By means of the change, a positional deviation of the semiconductor chip in the X direction can be ascertained. A positional deviation of the semiconductor chip in Y direction is determined, by observing whether or not an electrode is situated between extensions of sides of a certain portion of the section.
公开/授权文献
- US20030062604A1 Lead frame 公开/授权日：2003-04-03
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