发明授权
- 专利标题： Method of mounting component on circuit board
- 专利标题（中）： 组件安装在电路板上的方法
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申请号： US10076300申请日： 2002-02-19
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公开(公告)号： US06868603B2公开(公告)日： 2005-03-22
- 发明人: Osamu Okuda , Hiroshi Uchiyama , Hiroshi Furuya , Yoshihiro Mimura
- 申请人： Osamu Okuda , Hiroshi Uchiyama , Hiroshi Furuya , Yoshihiro Mimura
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP8-225088 19960827
- 主分类号： H05K13/04
- IPC分类号： H05K13/04 ; H05K3/30
摘要：
A component mounting method including carrying in a circuit board to a component mounting position and carrying out the circuit board after component-mounting operation. The component mounting operation includes sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. Also, a remaining-component discarding operation is performed to discard a component which remains at the suction nozzle during a specified time period following the component-mounting operation while the component mounting operation is stopped.
公开/授权文献
- US20020073536A1 Component mounting apparatus 公开/授权日：2002-06-20
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