- 专利标题： Methods of making microelectronic assemblies including compliant interfaces
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申请号： US10123547申请日： 2002-04-16
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公开(公告)号： US06870272B2公开(公告)日： 2005-03-22
- 发明人: Zlata Kovac , Craig Mitchell , Thomas Distefano , John Smith
- 申请人： Zlata Kovac , Craig Mitchell , Thomas Distefano , John Smith
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Lerner, David, Littenberg Krumholz & Mentlik, LLP
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/60 ; H01L23/31 ; H01L23/48 ; H01L23/498 ; H05K1/11 ; H05K3/36 ; H05K3/40
摘要：
An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.
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