发明授权
- 专利标题： Electrode-to-electrode bond structure
- 专利标题（中）： 电极对电极结合结构
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申请号： US10704553申请日： 2003-11-12
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公开(公告)号： US06873056B2公开(公告)日： 2005-03-29
- 发明人: Seiki Sakuyama , Nobuhiro Imaizumi , Tomohisa Yagi
- 申请人： Seiki Sakuyama , Nobuhiro Imaizumi , Tomohisa Yagi
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JP2001-331122 20011029; JP2002-65894 20020311
- 主分类号： H05K3/28
- IPC分类号： H05K3/28 ; H01L21/56 ; H01L21/60 ; H05K3/32 ; H05K3/34 ; H05K3/46 ; H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion. Then, an opening is formed in the resin coating to expose the first electrode portion. Then, the opening is filled with a metal paste containing a metal and a resin component. Then, the first bonding object is placed on a second bonding object having a second electrode portion in a manner such that the metal paste filled in the opening faces the second electrode portion while the resin coating contacts the second bonding object. Finally, heat-treatment is performed to cause the first electrode portion and the second electrode portion to be electrically connected with each other via the metal while causing the resin coating to harden.
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