发明授权
- 专利标题: Electronic component mounting apparatus
- 专利标题(中): 电子元件安装装置
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申请号: US10316348申请日: 2002-12-11
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公开(公告)号: US06874225B2公开(公告)日: 2005-04-05
- 发明人: Hiroshi Haji , Wataru Hidese
- 申请人: Hiroshi Haji , Wataru Hidese
- 申请人地址: JP Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Pearne & Gordon LLP
- 优先权: JPP2001-384338 20011218; JPP2001-384339 20011218; JPP2001-384340 20011218
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L21/00 ; B23P19/00
摘要:
In this electronic component mounting apparatus, a mounting head is movably arranged between the electronic component supplying unit and the board holding unit. A first camera for taking an image of the board in the board holding unit and detecting an electronic component mounting position, and a second camera for taking images of the chips of the electronic component supplying unit are arranged in such a manner that the first camera and the second camera can be entered/evacuated as against the electronic component supplying unit. Therefore, the electronic component supplying unit and the board holding unit are defined as a range to be transported, and the mounting head, the first camera, and the second camera are relatively traveled in conjunction to each other, a loss-time in both the electronic component supplying unit and the board holding unit can be avoided, and tact time can be shortened to improve a work-efficiency.