Invention Grant
- Patent Title: High density patching system
- Patent Title (中): 高密度贴片系统
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Application No.: US10278063Application Date: 2002-10-21
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Publication No.: US06875060B2Publication Date: 2005-04-05
- Inventor: Bruce Musolf , Roger Pautzke , Jeff Peters , Thomas Good
- Applicant: Bruce Musolf , Roger Pautzke , Jeff Peters , Thomas Good
- Applicant Address: US MN Eden Prairie
- Assignee: ADC Telecommunications, Inc.
- Current Assignee: ADC Telecommunications, Inc.
- Current Assignee Address: US MN Eden Prairie
- Agency: Merchant & Gould P.C.
- Main IPC: H01R24/58
- IPC: H01R24/58 ; H01R13/703 ; H04Q1/14 ; H01R24/04
Abstract:
A patching system is disclosed herein. The patching system includes a plurality of patching jacks. The jacks include switches for changing the circuit configurations of the patching circuitry of the jacks. The switches are positioned to enhance the circuit density of the patching system.
Public/Granted literature
- US20040077220A1 High density patching system Public/Granted day:2004-04-22
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