Invention Grant
- Patent Title: Heat-dissipating device and its manufacturing process
- Patent Title (中): 散热装置及其制造工艺
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Application No.: US10299842Application Date: 2002-11-20
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Publication No.: US06877958B2Publication Date: 2005-04-12
- Inventor: Chen-Chang Lin , Kuo-Cheng Lin , Wen-Shi Huang
- Applicant: Chen-Chang Lin , Kuo-Cheng Lin , Wen-Shi Huang
- Applicant Address: TW Taoyuan Hsien
- Assignee: Delta Electronics Inc.
- Current Assignee: Delta Electronics Inc.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Birch, Stewart, Kolasch, & Birch, LLP
- Priority: TW91203882U 20020328; TW91112474A 20020610
- Main IPC: B29C33/00
- IPC: B29C33/00 ; B29C45/44 ; F04D29/02 ; F04D29/32 ; F04D29/38 ; F04D5/02
Abstract:
A heat-dissipating device and its manufacturing process are provided for significantly increasing the number and size of blades so as to enhance the heat-dissipating performance. The heat-dissipating device has a plurality of blades arranged around the hub of the heat-dissipating device and there is an overlapped region formed between every two adjacent blades. A single mold is used to manufacture such a heat-dissipating device so that not only can the manufacturing cost be reduced but it can significantly increase the number and size of blades so as to increase the heat-dissipating efficiency.
Public/Granted literature
- US20030185681A1 Heat-dissipating device and its manufacturing process Public/Granted day:2003-10-02
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