发明授权
- 专利标题： Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
- 专利标题（中）： 使用折叠柔性基板的半导体器件的堆叠结构及其方法
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申请号： US10370013申请日： 2003-02-19
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公开(公告)号： US06879047B1公开(公告)日： 2005-04-12
- 发明人: Young Wook Heo
- 申请人： Young Wook Heo
- 申请人地址： US AZ Chandler
- 专利权人： Amkor Technology, Inc.
- 当前专利权人： Amkor Technology, Inc.
- 当前专利权人地址： US AZ Chandler
- 代理机构： Weiss, Moy & Harris, P.C.
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/538 ; H01L23/48
摘要：
A semiconductor stacking structure and method of producing the same has a flexible substrate. A plurality of apertures is formed on the flexible substrate. The plurality of apertures may be formed in groups for coupling semiconductor devices to the flexible substrate. A plurality of traces is formed on the flexible substrate for coupling the plurality of apertures together. A first semiconductor device is coupled to a first side of the flexible substrate. A first adhesive layer is placed on a first side of the flexible substrate for coupling the first semiconductor device to the first side of the flexible substrate. A plurality of contacts is coupled to a second side of the flexible substrate. The contacts and the first adhesive layer liquefy and flow into designated apertures when heated to couple the contacts to the first semiconductor device.
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