Invention Grant
- Patent Title: In-mold molded component
- Patent Title (中): 模内成型件
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Application No.: US10346168Application Date: 2003-01-17
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Publication No.: US06880992B2Publication Date: 2005-04-19
- Inventor: Kozo Odamura , Noboru Araki , Satoshi Yamada , Hitoshi Saito
- Applicant: Kozo Odamura , Noboru Araki , Satoshi Yamada , Hitoshi Saito
- Applicant Address: JP
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP
- Agency: Parkhurst & Wendel, L.L.P.
- Priority: JP2002-012580 20020122
- Main IPC: B41J32/00
- IPC: B41J32/00 ; B29C45/14 ; B29C70/72 ; G03G21/16 ; G06K19/00 ; G06K19/07 ; B41J35/28

Abstract:
There is provided a holding component for housing or holding a consumption article, which, in use, is detachably mounted in a printing apparatus, can be produced by a relatively simple method, can solve problems of tag separation and deteriorated positional accuracy, and can realize information communication in a stable and highly accurate manner. The in-mold molded component includes a holding component for housing or holding a consumption article, which, in use, is detachably mounted in a printing apparatus. Noncontact information storage means has been in-mold molded onto a part of the holding component so that the noncontact information storage means is bonded integrally to a substrate constituting the holding component.
Public/Granted literature
- US20030186009A1 In-mold molded component Public/Granted day:2003-10-02
Information query
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