A bonded member includes a ceramic base material and a metal member solid-phase bonded via a soldering material. An active metal is placed on a surface of the ceramic base material and the soldering material, which includes Au, is placed on the active metal, and the active metal and the soldering material are heated so as to form a precoat layer. The metal member is placed on the surface of the precoat layer via a barrier layer, which is capable of inhibiting diffusion of a metal constituting the metal member, and the precoat layer and the metal member are pressurized heated so as to be solid-phase bonded. The production method of the bonded member is also disclosed.