发明授权
- 专利标题: Package to die optical coupler having high coupling efficiency and alignment tolerance
- 专利标题(中): 封装到具有高耦合效率和对准公差的光耦合器
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申请号: US10606322申请日: 2003-06-24
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公开(公告)号: US06888990B2公开(公告)日: 2005-05-03
- 发明人: Bruce A. Block , Brandon Barnett , Paul Davids
- 申请人: Bruce A. Block , Brandon Barnett , Paul Davids
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: G02B6/12
- IPC分类号: G02B6/12 ; G02B6/125 ; G02B6/00 ; G02B6/26 ; G02B6/36
摘要:
In an embodiment of the invention, an optical coupler couples light unidirectionally from integrated circuit package to an integrated circuit die. The package has a large waveguide with a waveguide core that has a low index of refraction. The die has a set of very small waveguide cores that have a high index of refraction relative to the index of refraction of the large waveguide core on the package. The waveguide cores with high index of refraction attract light from the waveguide core with the low index of refraction. No light is coupled back into the large waveguide core. Also, the optical mode of the large waveguide on the package is smaller than a subset of waveguide cores on the die. Thus, light is coupled from the package to the die without the waveguide cores having to be tightly aligned with each other.