发明授权
- 专利标题： Multilayer board having precise perforations and circuit substrate having precise through-holes
- 专利标题（中）： 具有精确穿孔的多层板和具有精确通孔的电路基板
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申请号： US10784558申请日： 2004-02-23
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公开(公告)号： US06894888B2公开(公告)日： 2005-05-17
- 发明人: Yukihisa Takeuchi , Hiroyuki Tsuji , Kazumasa Kitamura , Yoshinori Yamaguchi
- 申请人： Yukihisa Takeuchi , Hiroyuki Tsuji , Kazumasa Kitamura , Yoshinori Yamaguchi
- 申请人地址： JP Nagoya
- 专利权人： NGK Insulators, Ltd.
- 当前专利权人： NGK Insulators, Ltd.
- 当前专利权人地址： JP Nagoya
- 代理机构： Burr & Brown
- 优先权： JP2001-172188 20010607
- 主分类号： B26F1/02
- IPC分类号： B26F1/02 ; B32B38/04 ; H05K3/00 ; H05K3/42 ; H05K3/46 ; H01G4/228
摘要：
An intermediate laminated structure is provided including a plurality of unfired ceramic plates stacked along a laminating direction. Each of the plates has a plurality of holes formed therethrough by a punching operation. At least a first hole in one of the plurality of unfired ceramic plates has the same shape and cross-sectional area as respective first holes in the remaining plurality of unfired ceramic plates such that the first holes define a cylinder of constant cross-sectional area throughout the entire thickness of the intermediate laminated structure.
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