发明授权
- 专利标题: Manufacturing method of over-current protection devices
- 专利标题(中): 过流保护装置的制造方法
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申请号: US10331749申请日: 2002-12-30
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公开(公告)号: US06895660B2公开(公告)日: 2005-05-24
- 发明人: Edward Fu-Hua Chu , David Shau-Chew Wang , Chih-Ming Yu
- 申请人: Edward Fu-Hua Chu , David Shau-Chew Wang , Chih-Ming Yu
- 申请人地址: TW Hsinchu
- 专利权人: Polytronics Technology Corporation
- 当前专利权人: Polytronics Technology Corporation
- 当前专利权人地址: TW Hsinchu
- 代理机构: Seyfarth Shaw LLP
- 优先权: TW90133499A 20011231
- 主分类号: H01C7/02
- IPC分类号: H01C7/02 ; H01C17/26 ; H01C7/04
摘要:
The present invention discloses a manufacturing method of an over-current protection device, characterized in that the PTC plaque is conducted by punching under frozen state to form the over-current protection devices so as to reduce the heating and temperature rising in the PTC plaque due to punching and temperature difference between the metal foil and the conductive composite material. Relatively, the deformation and stress of the over-current protection device caused by punching will also be reduced. Therefore, there is no need for additional process to increase the temperature sensitivity and electrical property stability of the over-current protection device.
公开/授权文献
- US20030121141A1 Manufacturing method of over-current protection devices 公开/授权日:2003-07-03
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