发明授权
- 专利标题： Processing apparatus and processing method
- 专利标题（中）： 处理装置及处理方法
-
申请号： US10359208申请日： 2003-02-06
-
公开(公告)号： US06895979B2公开(公告)日： 2005-05-24
- 发明人: Kyouji Kohama , Eiji Shimbo , Yuji Kamikawa , Takayuki Toshima , Hiroki Ohno
- 申请人： Kyouji Kohama , Eiji Shimbo , Yuji Kamikawa , Takayuki Toshima , Hiroki Ohno
- 申请人地址： JP Tokyo-To
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo-To
- 代理机构： Smith, Gambrell & Russell, LLP
- 优先权： JP11-119957 19990427; JP11-184191 19990629
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; B08B3/02 ; B08B3/10 ; H01L21/00
摘要：
A processing apparatus essentially includes a rotatable rotor 21 for carrying semiconductor wafers W, a motor 22 for driving to rotate the rotor 21, a plurality of processing chambers for surrounding the wafers W carried by the rotor 21, for example, an inner chamber 23 and an outer chamber 24, a chemical supplying unit 50, an IPA supplying unit 60, a rinse supplying unit 70 and a drying fluid supplying unit 80. With this constitution of the apparatus, it is possible to prevent the wafers from being contaminated due to the reaction of treatment liquids of different kinds, with the improvement of processing efficiency and miniaturization of the apparatus.
公开/授权文献
- US20030127117A1 Processing apparatus and processing method 公开/授权日：2003-07-10
信息查询
IPC分类:
