发明授权
- 专利标题： Bonding data setting device and method
- 专利标题（中）： 绑定数据设置和方法
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申请号： US10026255申请日： 2001-12-21
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公开(公告)号： US06901305B2公开(公告)日： 2005-05-31
- 发明人: Kazumasa Kimura , Hitoshi Watanabe
- 申请人： Kazumasa Kimura , Hitoshi Watanabe
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Shinkawa
- 当前专利权人： Kabushiki Kaisha Shinkawa
- 当前专利权人地址： JP Tokyo
- 代理机构： Koda & Androlia
- 优先权： JP2000-390835 20001222
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; B23K20/00 ; G06F19/00
摘要：
For facilitating and making more efficient the setting of the operating parameters of a bonding tool that is used to form a wire loop into a desired shape, when an editing handle is dragged, the loop shape of a wire loop line drawing displayed on a display screen is redrawn as a secondary loop line drawing. The values of the operating parameters corresponding to the loop shape of the drawn or redrawn secondary loop line drawing are calculated, and the results are displayed in a parameter list.
公开/授权文献
- US20020079348A1 Bonding data setting device and method 公开/授权日：2002-06-27
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