发明授权
- 专利标题： Multi-layer wiring circuit board and method for producing the same
- 专利标题（中）： 多层布线电路板及其制造方法
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申请号： US10109680申请日： 2002-04-01
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公开(公告)号： US06902949B2公开(公告)日： 2005-06-07
- 发明人: Hiroshi Yamazaki , Mineyoshi Hasegawa , Satoshi Tanigawa
- 申请人： Hiroshi Yamazaki , Mineyoshi Hasegawa , Satoshi Tanigawa
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Sughrue Mion, PLLC
- 优先权： JPP2001-102896 20010402
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/498 ; H05K3/00 ; H05K3/28 ; H05K3/38 ; H05K3/46 ; H01L21/44
摘要：
First and second metal foil layers are laminated on opposite surfaces of a first insulating layer to form a first board. Then, the first and second metal foil layers are formed into predetermined conductor patterns respectively. Then, second and third insulating layers of second and third boards formed separately from the first board are laminated on the first and second metal foil layers through first and second adhesive layers respectively. Then, a thin layer portion is removed and thick layer portions are formed into predetermined conductor patterns respectively in third and fourth metal foil layers of the second and third boards.
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