公开(公告)号：US06902949B2

公开(公告)日：2005-06-07

申请号：US10109680

申请日：2002-04-01

申请人： Hiroshi Yamazaki ,  Mineyoshi Hasegawa ,  Satoshi Tanigawa

发明人： Hiroshi Yamazaki ,  Mineyoshi Hasegawa ,  Satoshi Tanigawa

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K3/00 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46 ,  H01L21/44

CPC分类号： H05K3/4691 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K3/002 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0358 ,  H01L2924/00

摘要： First and second metal foil layers are laminated on opposite surfaces of a first insulating layer to form a first board. Then, the first and second metal foil layers are formed into predetermined conductor patterns respectively. Then, second and third insulating layers of second and third boards formed separately from the first board are laminated on the first and second metal foil layers through first and second adhesive layers respectively. Then, a thin layer portion is removed and thick layer portions are formed into predetermined conductor patterns respectively in third and fourth metal foil layers of the second and third boards.

摘要翻译： 第一和第二金属箔层层叠在第一绝缘层的相对表面上以形成第一板。 然后，第一和第二金属箔层分别形成预定的导体图案。 然后，分别与第一基板形成的第二和第三板的第二绝缘层和第三绝缘层分别通过第一和第二粘合剂层层压在第一和第二金属箔层上。 然后，去除薄层部分，并且将厚层部分分别形成为第二和第三板的第三和第四金属箔层中的预定导体图案。

公开(公告)号：US06887560B2

公开(公告)日：2005-05-03

申请号：US10363165

申请日：2002-07-03

申请人： Kei Nakamura ,  Satoshi Tanigawa ,  Hiroshi Yamazaki ,  Mineyoshi Hasegawa

发明人： Kei Nakamura ,  Satoshi Tanigawa ,  Hiroshi Yamazaki ,  Mineyoshi Hasegawa

IPC分类号： H05K3/40 ,  H05K1/00 ,  H05K1/02 ,  H05K3/20 ,  H05K3/28 ,  H05K3/46 ,  B32B3/00

CPC分类号： H05K3/4658 ,  H05K1/0393 ,  H05K3/20 ,  H05K3/281 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4617 ,  H05K3/4635 ,  H05K3/4652 ,  H05K2201/0305 ,  H05K2201/09536 ,  H05K2203/0425 ,  Y10S428/901 ,  Y10T428/24917

摘要： A multilayer flexible wired circuit board that can provide high density wiring and also can provide reduction in thickness and size, and a producing method thereof. A four-layered flexible wired circuit board is produced by preparing a double-sided substrate in which a first conductor layer and a second conductor layer are laminated on both sides of a first insulating layer; preparing a first single-sided substrate in which a third conductor layer is laminated on one surface of a second insulating layer and a second single-sided substrate in which a fourth conductor layer is laminated on one surface of a third insulating layer; bonding the first conductor layer and the third conductor layer to each other through a first thermosetting adhesive layer; and bonding the second conductor layer and the fourth conductor layer to each other through a second thermosetting adhesive layer.

摘要翻译： 一种可提供高密度布线并且还可以提供厚度和尺寸的减小的多层柔性布线电路板及其制造方法。 通过制备在第一绝缘层的两侧上层叠有第一导体层和第二导体层的双面基板来制造四层柔性布线电路板; 制备其中在第二绝缘层的一个表面上层叠第三导体层的第一单面基板和在第三绝缘层的一个表面上层叠第四导体层的第二单面基板; 通过第一热固性粘合剂层将第一导体层和第三导体层彼此接合; 以及通过第二热固性粘合剂层将所述第二导体层和所述第四导体层彼此接合。

公开(公告)号：US20130014988A1

公开(公告)日：2013-01-17

申请号：US13521899

申请日：2011-04-26

申请人： Osamu Sato ,  Atsushi Murata ,  Makoto Kamiya ,  Satoshi Tanigawa ,  Shinichi Igarashi ,  Nobumasa Takihara ,  Yukihiro Shirafuji ,  Masamichi Yamagiwa ,  Yutaka Takata ,  Hiroto Ueno

发明人： Osamu Sato ,  Atsushi Murata ,  Makoto Kamiya ,  Satoshi Tanigawa ,  Shinichi Igarashi ,  Nobumasa Takihara ,  Yukihiro Shirafuji ,  Masamichi Yamagiwa ,  Yutaka Takata ,  Hiroto Ueno

IPC分类号： H02G3/04

CPC分类号： H02G3/0481 ,  D04H1/435 ,  D04H1/541

摘要： A wire harness has an exterior component (11a) that covers a certain part of at least one wires (12). The exterior component (11a) has parts having different hardness, including a relatively hard first part (111a), a relatively soft second part (112a), and a third part (113a) having an intermediate hardness between that of the first parts (111a, 112a). The first part is formed on a surface of the exterior component and functions as a shape keeping member and a protector. The second and third parts (112a, 113a) surround the certain part of the at least one wire 12 and each functions as a cushioning material and a muffler/soundproofing material. The first part (111a), the second part (112a), and the third part (113a) are formed integrally from a non-woven fabric (2) with thermo plasticity.

摘要翻译： 线束具有覆盖至少一根线（12）的某一部分的外部部件（11a）。 外部部件（11a）具有不同硬度的部件，包括比较硬的第一部分（111a），相对较软的第二部分（112a）和第三部分（113a），第三部分（113a）具有在第一部分 ，112a）。 第一部分形成在外部部件的表面上并用作形状保持部件和保护件。 第二和第三部分（112a，113a）围绕至少一根线12的某一部分，并且各自用作缓冲材料和消声器/隔音材料。 第一部分（111a），第二部分（112a）和第三部分（113a）由热塑性的无纺布（2）整体形成。

公开(公告)号：USD532386S1

公开(公告)日：2006-11-21

申请号：US29203145

申请日：2004-04-08

申请人： Yutaka Negishi ,  Mitsunari Fujii ,  Tatsuyoshi Asawa ,  Satoshi Tanigawa

设计人： Yutaka Negishi ,  Mitsunari Fujii ,  Tatsuyoshi Asawa ,  Satoshi Tanigawa

公开(公告)号：US20050208421A1

公开(公告)日：2005-09-22

申请号：US11081516

申请日：2005-03-17

申请人： Hirofumi Fujii ,  Yasuhito Funada ,  Satoshi Tanigawa

发明人： Hirofumi Fujii ,  Yasuhito Funada ,  Satoshi Tanigawa

IPC分类号： G03F7/031 ,  C08F2/44 ,  C08F283/04 ,  C08G73/10 ,  G03C1/492 ,  G03F7/004 ,  G03F7/027 ,  G03F7/037 ,  G03F7/20 ,  H01L21/027

CPC分类号： G03F7/031 ,  C08K5/3432 ,  C08L79/08 ,  G03F7/037 ,  C08L79/04

摘要： A photosensitive resin composition which, when exposed to light through a photomask and then developed, can form a pattern comprising a polyimide film having a thickness of 20 μm or larger with high resolution; and a use of the composition, in particular, a method of forming a pattern comprising the polyimide film. The photosensitive resin composition comprises (a) a poly(amic acid), (b) a specific 1,4-dihydropyridine derivative, and (c) a specific imide acrylate compound.

摘要翻译： 一种光敏树脂组合物，当通过光掩模曝光然后显影时，可以以高分辨率形成包含厚度为20μm或更大的聚酰亚胺膜的图案; 以及组合物的使用，特别是形成包含聚酰亚胺膜的图案的方法。 感光性树脂组合物包含（a）聚（酰胺酸），（b）特定的1,4-二氢吡啶衍生物和（c）特定的酰亚胺丙烯酸酯化合物。

公开(公告)号：US06851599B2

公开(公告)日：2005-02-08

申请号：US10363167

申请日：2002-07-03

申请人： Kei Nakamura ,  Satoshi Tanigawa ,  Shinya Oota

发明人： Kei Nakamura ,  Satoshi Tanigawa ,  Shinya Oota

IPC分类号： H05K3/40 ,  H05K3/46 ,  B23K31/02

CPC分类号： H05K3/462 ,  H05K3/4038 ,  H05K3/4623 ,  H05K2201/0305 ,  H05K2201/09536 ,  H05K2203/0425 ,  Y10T156/10

摘要： A method of producing a multilayer wired circuit board that can provide sufficient adhesion strength of the interface between a conductor layer and a thermosetting adhesive layer laminated, to provide improvement in connection strength between the conductor layers and thus improvement in reliability. In this method, after a thermosetting adhesive layer is formed on a first conductor layer, an opening is formed in the thermosetting adhesive layer and solder powders are charged in the opening at normal temperature. Sequentially, a second conductor layer is formed on the thermosetting adhesive layer including the opening filled with the solder powders. Thereafter, the solder powders are melted by heating, to electrically connect between the first conductor layer and the second conductor layer.

摘要翻译： 一种多层布线电路板的制造方法，其能够提供层叠的导体层和热固性粘合层之间的界面的充分的粘合强度，以提高导体层之间的连接强度，从而提高可靠性。 在该方法中，在第一导体层上形成热固性粘合剂层之后，在热固性粘合剂层中形成开口，并且在常温下在开口中填充焊料粉末。 接着，在包含填充有焊料粉末的开口的热固性粘合剂层上形成第二导体层。 此后，通过加热熔化焊料粉末，以电连接第一导体层和第二导体层之间。

公开(公告)号：US06772515B2

公开(公告)日：2004-08-10

申请号：US09960919

申请日：2001-09-25

申请人： Tokihito Suwa ,  Atsushi Tanaka ,  Satoshi Tanigawa ,  Hirofumi Fujii ,  Kazunori Mune

发明人： Tokihito Suwa ,  Atsushi Tanaka ,  Satoshi Tanigawa ,  Hirofumi Fujii ,  Kazunori Mune

IPC分类号： H05K302

CPC分类号： H05K3/4644 ,  H05K1/09 ,  H05K3/108 ,  H05K3/388 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0344 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09563 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： To provide a method of producing a multilayer printed wiring board that can be intended to have low-profile, light-weight and high-density wiring of a printed wiring board, and a multilayer printed wiring board produced by the method of producing a multilayer printed wiring board, the double-sided substrate is produced by the steps of forming an insulating resin layer on a metal foil; of forming a via hole in the insulating resin layer; of forming a first circuit pattern on the insulating resin layer and forming a conductive layer in the via hole, by plating; and of etching the metal foil to form it into a second circuit pattern. The produced double-sided substrate is used as a core substrate for producing multilayer printed wiring board by a laminate-en-bloc or a build-up method.

摘要翻译： 本发明提供一种制造多层印刷电路板的方法，所述多层印刷电路板可以用于印刷电路板的薄型，重量轻和高密度布线，以及通过制造多层印刷方法制造的多层印刷线路板 通过在金属箔上形成绝缘树脂层的步骤制造双面基板; 在所述绝缘树脂层中形成通孔; 在所述绝缘树脂层上形成第一电路图案，并在所述通孔中形成导电层，通过电镀; 并蚀刻金属箔以形成第二电路图案。 将生产的双面基板用作通过层叠体或堆积方法制造多层印刷线路板的核心基板。

公开(公告)号：US06662442B1

公开(公告)日：2003-12-16

申请号：US09619502

申请日：2000-07-19

申请人： Kouji Matsui ,  Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

发明人： Kouji Matsui ,  Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

IPC分类号： H01K310

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4007 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A process for producing a printed wiring board, particularly an interposer for a chip size package, which comprises the steps of (1) forming an outer insulator layer 22 having outer via-holes 24 on a substrate 32, (2) forming conducting passages 31 through the outer via-holes 24 by plating with metal up to substantially the same level as the upper surface of the outer insulator layer 22, (3) forming a thin metal film 29 on the outer insulator layer 22 and on the conducting passages 31, (4) forming a conductor layer 21 in a prescribed circuit pattern on the thin metal film 29 by plating, (5) removing the part of the thin metal film 29 on which the conductor layer 21 is not formed, (6) forming an inner insulator layer 23 on the conductor layer 21, and (7) removing the substrate 32. The outer insulator layer is formed with flatness to secure good adhesion to a semiconductor chip.

摘要翻译： 一种用于制造印刷线路板的方法，特别是用于芯片尺寸封装的插入件，其包括以下步骤：（1）在基板32上形成具有外部通孔24的外部绝缘体层22，（2）形成导电通路31 通过用外部绝缘体层22的上表面大致相同的金属镀覆外部通孔24，（3）在外绝缘体层22和导电路31上形成薄金属膜29， （4）通过电镀在薄金属膜29上形成规定的电路图案的导体层21，（5）除去未形成导体层21的金属薄膜29的一部分，（6）形成内部 导体层21上的绝缘体层23，以及（7）去除衬底32.外绝缘层形成为平坦度，以确保对半导体芯片的良好粘合性。

公开(公告)号：US06591491B2

公开(公告)日：2003-07-15

申请号：US09799684

申请日：2001-03-07

申请人： Hirofumi Fujii ,  Satoshi Tanigawa

发明人： Hirofumi Fujii ,  Satoshi Tanigawa

IPC分类号： H05K336

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L23/3107 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/0023 ,  H05K3/007 ,  H05K3/108 ,  H05K3/20 ,  H05K3/388 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4658 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2203/0152 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/4981 ,  H01L2924/00

摘要： A producing method of a multilayer circuit board for ensuring that a circuit board, such as an interposer, is provided on the multilayer circuit board. The method includes the steps forming the interposer on a support board; forming a multilayer circuit board separately from the interposer; joining the interposer formed on the support board to the multilayer circuit board; and then removing the support board. According to this method, even if the production of the interposer fails after the production of the multilayer circuit board, it is possible to scrap the interposer only and there is no need to scrap it together with the multilayer circuit board. Besides, although the interposer is thin and limp, since it is formed on the support board, the interposer can surely and readily be joined to the multilayer circuit board.

摘要翻译： 一种多层电路板的制造方法，用于确保在多层电路板上设置诸如插入件的电路板。 该方法包括在支撑板上形成插入件的步骤; 与所述插入件分开形成多层电路板; 将形成在所述支撑板上的所述插入件接合到所述多层电路板; 然后卸下支撑板。 根据该方法，即使在制造多层电路板之后插入件的制造失败，也可以仅仅拆卸插入件，并且不需要与多层电路板一起将其废弃。 此外，虽然插入件薄且跛脚，但是由于其形成在支撑板上，所以插入器可以可靠地容易地接合到多层电路板。

公开(公告)号：US08497426B2

公开(公告)日：2013-07-30

申请号：US13521899

申请日：2011-04-26

申请人： Osamu Sato ,  Atsushi Murata ,  Makoto Kamiya ,  Satoshi Tanigawa ,  Shinichi Igarashi ,  Nobumasa Takihara ,  Yukihiro Shirafuji ,  Masamichi Yamagiwa ,  Yutaka Takata ,  Hiroto Ueno

发明人： Osamu Sato ,  Atsushi Murata ,  Makoto Kamiya ,  Satoshi Tanigawa ,  Shinichi Igarashi ,  Nobumasa Takihara ,  Yukihiro Shirafuji ,  Masamichi Yamagiwa ,  Yutaka Takata ,  Hiroto Ueno

IPC分类号： H02G3/04

CPC分类号： H02G3/0481 ,  D04H1/435 ,  D04H1/541

摘要： A wire harness has an exterior component (11a) that covers a certain part of at least one wires (12). The exterior component (11a) has parts having different hardness, including a relatively hard first part (111a), a relatively soft second part (112a), and a third part (113a) having an intermediate hardness between that of the first parts (111a, 112a). The first part is formed on a surface of the exterior component and functions as a shape keeping member and a protector. The second and third parts (112a, 113a) surround the certain part of the at least one wire 12 and each functions as a cushioning material and a muffler/soundproofing material. The first part (111a), the second part (112a), and the third part (113a) are formed integrally from a non-woven fabric (2) with thermo plasticity.

摘要翻译： 线束具有覆盖至少一根线（12）的某一部分的外部部件（11a）。 外部部件（11a）具有不同硬度的部件，包括相对较硬的第一部分（111a），较软的第二部分（112a）和第三部分（113a），其具有在第一部分 ，112a）。 第一部分形成在外部部件的表面上并用作形状保持部件和保护件。 第二和第三部分（112a，113a）围绕至少一根线12的某一部分，并且各自用作缓冲材料和消声器/隔音材料。 第一部分（111a），第二部分（112a）和第三部分（113a）由热塑性的无纺布（2）整体形成。