Invention Grant
- Patent Title: Method for fabricating transistor having fully silicided gate
- Patent Title (中): 制造具有完全硅化栅的晶体管的方法
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Application No.: US10643675Application Date: 2003-08-15
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Publication No.: US06902994B2Publication Date: 2005-06-07
- Inventor: Yoyi Gong , Tony Lin , Jung-Tsung Tseng , Abula Yu
- Applicant: Yoyi Gong , Tony Lin , Jung-Tsung Tseng , Abula Yu
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/285 ; H01L21/336 ; H01L29/417 ; H01L21/3205

Abstract:
A method for fabricating a transistor having a fully silicided gate is described. A silicon substrate with a semi-finished transistor formed thereon is provided, wherein the transistor comprises a gate dielectric film, a silicon gate, a cap layer on the silicon gate, a spacer and a source/drain region. A raised source/drain is formed on the source/drain region, and then the cap layer is removed. Subsequently, a full silicidation process is performed to fully silicide the silicon gate.
Public/Granted literature
- US20050037558A1 Method for fabricating transistor having fully silicided gate Public/Granted day:2005-02-17
Information query
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