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US06902994B2 Method for fabricating transistor having fully silicided gate 有权
制造具有完全硅化栅的晶体管的方法

Method for fabricating transistor having fully silicided gate
Abstract:
A method for fabricating a transistor having a fully silicided gate is described. A silicon substrate with a semi-finished transistor formed thereon is provided, wherein the transistor comprises a gate dielectric film, a silicon gate, a cap layer on the silicon gate, a spacer and a source/drain region. A raised source/drain is formed on the source/drain region, and then the cap layer is removed. Subsequently, a full silicidation process is performed to fully silicide the silicon gate.
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