发明授权
- 专利标题: Covering element for subassemblies
- 专利标题(中): 子组件覆盖件
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申请号: US10210602申请日: 2002-08-01
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公开(公告)号: US06903932B2公开(公告)日: 2005-06-07
- 发明人: Ingo Wennemuth , Volker Strutz , Uta Gebauer
- 申请人: Ingo Wennemuth , Volker Strutz , Uta Gebauer
- 申请人地址: DE Munich
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Munich
- 代理商 Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- 优先权: DE10137619 20010801
- 主分类号: H01L23/10
- IPC分类号: H01L23/10 ; H01L25/065 ; H05K7/20
摘要:
A covering element for covering subassemblies having a substrate and at least one component disposed thereon and to be protected, in particular, a semiconductor component, includes at least one substantially planar area for covering the at least one component to be protected, one or more moldings serving for mechanical support, at least one of the moldings being in contact with the substrate and/or a supporting element disposed on the substrate after the covering element has been mounted on the subassembly, and the planar area and the molding being disposed such that, in the event of pressure on the covering element, no displacement of the at least one component (4) to be protected occurs.
公开/授权文献
- US20030026077A1 Covering element for subassemblies 公开/授权日:2003-02-06