公开(公告)号：US06903932B2

公开(公告)日：2005-06-07

申请号：US10210602

申请日：2002-08-01

申请人： Ingo Wennemuth ,  Volker Strutz ,  Uta Gebauer

发明人： Ingo Wennemuth ,  Volker Strutz ,  Uta Gebauer

IPC分类号： H01L23/10 ,  H01L25/065 ,  H05K7/20

CPC分类号： H01L23/10 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/16152 ,  H01L2924/16153

摘要： A covering element for covering subassemblies having a substrate and at least one component disposed thereon and to be protected, in particular, a semiconductor component, includes at least one substantially planar area for covering the at least one component to be protected, one or more moldings serving for mechanical support, at least one of the moldings being in contact with the substrate and/or a supporting element disposed on the substrate after the covering element has been mounted on the subassembly, and the planar area and the molding being disposed such that, in the event of pressure on the covering element, no displacement of the at least one component (4) to be protected occurs.

摘要翻译： 用于覆盖具有基底的覆盖元件和设置在其上并被保护的至少一个部件，特别是半导体部件的覆盖元件包括至少一个基本上平坦的区域，用于覆盖至少一个待保护元件，一个或多个模制品 用于机械支撑，所述模制品中的至少一个在所述覆盖元件已经安装在所述子组件上之后与所述基板和/或设置在所述基板上的支撑元件接触，并且所述平面区域和所述模制件被设置成使得， 在被覆件的压力的情况下，不会发生被保护的至少一个部件（4）的位移。

公开(公告)号：US07235873B2

公开(公告)日：2007-06-26

申请号：US10210218

申请日：2002-08-01

申请人： Volker Strutz ,  Uta Gebauer

发明人： Volker Strutz ,  Uta Gebauer

IPC分类号： H01L23/02 ,  H01L23/28 ,  H01L23/29 ,  H01L21/00 ,  H01L21/66

CPC分类号： H01L21/54 ,  H01L23/24 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/16195 ,  Y10T29/4913 ,  Y10T29/49146

摘要： A protective device for subassemblies having a substrate and at least one component to be protected which is disposed on the substrate includes at least one covering element for covering a subassembly. An expanded filler material fills at least one given space between the substrate and the covering element and provides protection against mechanical compression. A method of producing a protective device is also provided. An expandable material is applied to the substrate and is expanded after the covering element has been mounted.

摘要翻译： 用于具有衬底和至少一个待保护部件的子组件的保护装置设置在衬底上，包括用于覆盖子组件的至少一个覆盖元件。 膨胀的填充材料在基材和覆盖元件之间填充至少一个给定的空间，并提供防止机械压缩的保护。 还提供了一种制造保护装置的方法。 将可膨胀材料施加到基底上，并在覆盖元件安装之后进行扩张。

公开(公告)号：US06815613B2

公开(公告)日：2004-11-09

申请号：US09951823

申请日：2001-09-13

申请人： Uta Gebauer ,  Volker Strutz

发明人： Uta Gebauer ,  Volker Strutz

IPC分类号： H02G308

CPC分类号： H01L24/16 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/16105 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/81898 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/0373 ,  H05K2201/09427 ,  H05K2201/10242 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/05099

摘要： The invention relates to an electronic component with external connection elements and to a method of electrically connecting and/or fixing an electronic component to a printed-circuit board. For this purpose, the electronic component has capillary elements as external connection elements, which are connected to contact connection areas of a leadframe or to contact areas of a chip. The capillary element protrudes out of the electronic component and has, on its protruding end, a suction opening with capillary action.

摘要翻译： 本发明涉及一种具有外部连接元件的电子元件以及将电子元件电连接和/或固定到印刷电路板的方法。 为此，电子部件具有作为外部连接元件的毛细管元件，其连接到引线框架的接触连接区域或接触芯片的区域。 毛细管元件从电子部件突出，并且在其突出端具有毛细管作用的抽吸开口。

公开(公告)号：US06927487B2

公开(公告)日：2005-08-09

申请号：US10210666

申请日：2002-08-01

申请人： Uta Gebauer ,  Volker Strutz

发明人： Uta Gebauer ,  Volker Strutz

IPC分类号： H01L23/16 ,  H01L23/36 ,  H05K3/30 ,  H01L23/12

CPC分类号： H01L23/16 ,  H01L23/36 ,  H01L2924/0002 ,  H05K3/301 ,  H01L2924/00

摘要： A protective device is provided for subassemblies having a substrate and a component disposed thereon and needing to be protected. The component typically is a semiconductor component. The protective device includes a covering element, a spacer, and a guide. The covering element covers a subassembly. The spacer is disposed between the covering element and the substrate for maintaining a predefined spacing between the covering element and the component to be protected in the area of the spacer. The guide is used for fixing a free end of the spacer to the covering element and/or to the substrate in a predefined X and/or Y position.

摘要翻译： 为具有衬底和设置在其上并且需要被保护的部件的子组件提供保护装置。 该组件通常是半导体组件。 保护装置包括覆盖元件，间隔件和引导件。 覆盖元件覆盖子组件。 间隔件设置在覆盖元件和基板之间，用于在间隔件的区域中保持覆盖元件和待保护元件之间的预定间隔。 引导件用于将预定义的X和/或Y位置中的间隔件的自由端固定到覆盖元件和/或基板上。

公开(公告)号：US06851598B2

公开(公告)日：2005-02-08

申请号：US10205081

申请日：2002-07-25

申请人： Uta Gebauer ,  Harry Hedler ,  Jürgen Högerl ,  Volker Strutz

发明人： Uta Gebauer ,  Harry Hedler ,  Jürgen Högerl ,  Volker Strutz

IPC分类号： B23K1/00 ,  H01L21/60 ,  H05K3/32 ,  B23K31/00 ,  B23K31/02

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L24/14 ,  H01L24/17 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/10135 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/45144 ,  H01L2224/73253 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/325 ,  H05K2201/09781 ,  H05K2201/2036 ,  H01L2924/00

摘要： An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.

摘要翻译： 描述了具有至少一个半导体芯片和布线层的电子部件。 布线层具有在空间方向x，y和z上具有低机械强度的弹性接触元件，其可以电连接到印刷电路板的相应接触端子区域。 半导体芯片或布线层另外具有至少两个用于机械连接到印刷电路板的间隔件。 还描述了用于制造电子部件的方法。

公开(公告)号：US09013890B2

公开(公告)日：2015-04-21

申请号：US13348531

申请日：2012-01-11

申请人： Udo Ausserlechner ,  Carsten von Koblinski ,  Sigrid Wabnig ,  Volker Strutz ,  Robert Grünberger

发明人： Udo Ausserlechner ,  Carsten von Koblinski ,  Sigrid Wabnig ,  Volker Strutz ,  Robert Grünberger

IPC分类号： H05K7/00 ,  G01R15/20 ,  G01R33/07 ,  H01L23/16 ,  H01L23/31 ,  H01L23/00

CPC分类号： G01R15/20 ,  G01R15/207 ,  G01R33/072 ,  H01L23/047 ,  H01L23/16 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32111 ,  H01L2224/32237 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48463 ,  H01L2224/49107 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49177 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： In one embodiment, a semiconductor package includes an isolating container having a recess, which forms an inner membrane portion and an outer rim portion. The rim portion is thicker than the membrane portion. The package includes a semiconductor chip disposed in the recess and a backplane disposed under the membrane portion of the isolating container.

摘要翻译： 在一个实施例中，半导体封装包括具有形成内膜部分和外缘部分的凹部的隔离容器。 边缘部分比膜部分厚。 封装包括设置在凹部中的半导体芯片和设置在隔离容器的膜部下方的背板。

公开(公告)号：US08071433B2

公开(公告)日：2011-12-06

申请号：US12868422

申请日：2010-08-25

申请人： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

发明人： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC分类号： H01L21/00 ,  H01L21/337

CPC分类号： H01L25/165 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10045 ,  H05K2201/10977 ,  Y02P70/613

摘要： A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.

摘要翻译： 一种半导体部件，包括：衬底，布置在衬底上的至少一个半导体芯片和同样布置在衬底上的至少一个无源器件。 无源器件的底面安装在基板上。 半导体部件还包括设置在无源器件的下侧和衬底之间的间隙。 该间隙填充有底部填充材料。 为了避免焊料泵送效应，无源器件的上侧和侧面也嵌入塑料化合物中。

公开(公告)号：US07998797B2

公开(公告)日：2011-08-16

申请号：US12330676

申请日：2008-12-09

申请人： Thomas Killer ,  Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Volker Strutz ,  Hermann Josef Lutz

发明人： Thomas Killer ,  Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Volker Strutz ,  Hermann Josef Lutz

IPC分类号： H01L21/00 ,  H01L23/12

CPC分类号： H01L23/4985 ,  H01L21/6835 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/48 ,  H01L2221/68386 ,  H01L2224/04042 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of assembling a semiconductor device includes providing a chip attached to an elastic carrier, and supporting the elastic carrier with a stiffener. The method additionally includes removing the stiffener from the elastic carrier after attaching the elastic carrier to a board.

摘要翻译： 组装半导体器件的方法包括提供附接到弹性载体的芯片，并且用加强件支撑弹性载体。 该方法还包括在将弹性载体附接到板上之后从弹性载体移除加强件。

公开(公告)号：US07688592B2

公开(公告)日：2010-03-30

申请号：US10598285

申请日：2005-02-22

申请人： Gerold Gruendler ,  Juergen Hoegerl ,  Volker Strutz ,  Erick Syri

发明人： Gerold Gruendler ,  Juergen Hoegerl ,  Volker Strutz ,  Erick Syri

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/4093 ,  F28F2280/10 ,  H01L23/36 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling system for devices having power semiconductors and a method for cooling the device is disclosed. In one embodiment, the cooling system has printed circuit boards arranged on a circuit carrier in plug-in contact strips. The cooling system itself has a cooling plate, which is mounted in a pivotable manner on one of the plug-in contact strips in the region of the power semiconductor component. The cooling plate can be pivoted about an axis in such a way that it assumes a first position, which is pivoted away from the printed circuit board, and a second position, in which the cooling plate bears on the power semiconductor component.

摘要翻译： 公开了一种用于具有功率半导体的器件的冷却系统和用于冷却器件的方法。 在一个实施例中，冷却系统具有布置在插入式接触条中的电路载体上的印刷电路板。 冷却系统本身具有冷却板，该冷却板以可枢转的方式安装在功率半导体部件的区域中的一个插入式接触片上。 冷却板可以围绕轴线枢转，使得其呈现离开印刷电路板的第一位置，第二位置和冷却板承载在功率半导体部件上的第二位置。

公开(公告)号：US20070262433A1

公开(公告)日：2007-11-15

申请号：US11748135

申请日：2007-05-14

申请人： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

发明人： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L25/165 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10045 ,  H05K2201/10977 ,  Y02P70/613

摘要： A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.

摘要翻译： 一种半导体部件，包括：衬底，布置在衬底上的至少一个半导体芯片和同样布置在衬底上的至少一个无源器件。 无源器件的底面安装在基板上。 半导体部件还包括设置在无源器件的下侧和衬底之间的间隙。 该间隙填充有底部填充材料。 为了避免焊料泵送效应，无源器件的上侧和侧面也嵌入塑料化合物中。